Presentation | 2004/1/29 Back Side Failure Analysis Technique for Multiple Interconnects T. Nakashima, A. Onoyama, E. Yoshida, T. Koyama, J. Komori, Y. Mashiko, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We developed a new fault isolation technique for multiple interconnect structure in SOC devices, which applies the voltage contrast method from the rear side of the exposed metal interconnects. It makes possible to detect failure points in lower layers which it is difficult to be detected by conventional techniques. Also the technique realizes the efficient analysis, as it is possible to observe every exposed node of circuit. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Multiple Interconnects / Back side / Voltage contrast |
Paper # | CPM2003-162,ICD2003-201 |
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Conference Information | |
Committee | CPM |
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Conference Date | 2004/1/29(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Back Side Failure Analysis Technique for Multiple Interconnects |
Sub Title (in English) | |
Keyword(1) | Multiple Interconnects |
Keyword(2) | Back side |
Keyword(3) | Voltage contrast |
1st Author's Name | T. Nakashima |
1st Author's Affiliation | Renesas Semiconductor Engineering Corporation() |
2nd Author's Name | A. Onoyama |
2nd Author's Affiliation | Mitsubishi Electric Corporation |
3rd Author's Name | E. Yoshida |
3rd Author's Affiliation | Renesas Technology Corporation |
4th Author's Name | T. Koyama |
4th Author's Affiliation | Renesas Technology Corporation |
5th Author's Name | J. Komori |
5th Author's Affiliation | Renesas Technology Corporation |
6th Author's Name | Y. Mashiko |
6th Author's Affiliation | Renesas Technology Corporation |
Date | 2004/1/29 |
Paper # | CPM2003-162,ICD2003-201 |
Volume (vol) | vol.103 |
Number (no) | 645 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |