Presentation 2003/11/3
High-resolution x-ray diffraction study of Si_<0.75>Ge_<0.25> alloy layers with Sb mediated LT-Si buffers
M. M. Rahman, S. Q. Zheng, T. Tambo, C. Tatsuyama,
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Abstract(in English) High-resolution x-ray diffraction was used to determine the residual strain in the Si_<0.75>Ge_<0.25> alloy with Sb mediated low temperature grown Si (LT-Si) buffer layers as a function of the growth temperature of the buffer layers. A very thin Ge layer was grown just before LT-Si, which may be favorable for the creation of dislocation nucleation sites. Residual strain of the alloy layers decreased with decreasing of the growth temperature of the buffer layers and reached to a lower value of about-0.06% with 300℃-grown buffer. Topographic study by AFM revealed very smooth surfaces of the alloys.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) High-resolution x-ray diffraction (HRXRD) / Low temperature grown Si buffer (LT-Si) / X-ray reflectivity / Atomic force microscopy (AFM)
Paper # CPM2003-132
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Committee CPM
Conference Date 2003/11/3(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High-resolution x-ray diffraction study of Si_<0.75>Ge_<0.25> alloy layers with Sb mediated LT-Si buffers
Sub Title (in English)
Keyword(1) High-resolution x-ray diffraction (HRXRD)
Keyword(2) Low temperature grown Si buffer (LT-Si)
Keyword(3) X-ray reflectivity
Keyword(4) Atomic force microscopy (AFM)
1st Author's Name M. M. Rahman
1st Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Toyama Universiy()
2nd Author's Name S. Q. Zheng
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Toyama Universiy
3rd Author's Name T. Tambo
3rd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Toyama Universiy
4th Author's Name C. Tatsuyama
4th Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Toyama Universiy
Date 2003/11/3
Paper # CPM2003-132
Volume (vol) vol.103
Number (no) 411
Page pp.pp.-
#Pages 5
Date of Issue