Presentation 2003/9/25
Reduction of Threading Dislocation in AlGaN with High Al Composition by Regrowth on Grooved Structure
Masahiro ISHIDA, Masaaki YURI, Daisuke UEDA, Hiroyasu ISHIKAWA, Takashi EGAWA,
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Abstract(in English) Crack-free AlGaN with a high Al composition were grown on an AlN template substrate. We found that low-dislocation-density regions are formed in the AlGaN layer regrown on grooved structure. By employing the regrowth technology twice, threding dislocations in the regrown AlGaN were reduced down to 5.2×10^7cm^<-2>.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) AlGaN / AlN template / Regrowth / Threding dislocation / Regrowth / Grooved structure / TEM / CL
Paper # ED2003-140,CPM2003-110,LQE2003-58
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Committee CPM
Conference Date 2003/9/25(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Reduction of Threading Dislocation in AlGaN with High Al Composition by Regrowth on Grooved Structure
Sub Title (in English)
Keyword(1) AlGaN
Keyword(2) AlN template
Keyword(3) Regrowth
Keyword(4) Threding dislocation
Keyword(5) Regrowth
Keyword(6) Grooved structure
Keyword(7) TEM
Keyword(8) CL
1st Author's Name Masahiro ISHIDA
1st Author's Affiliation Semiconductor Device Research Center, Semiconductor Company, Matsushita Electric Industrial Co., Ltd.()
2nd Author's Name Masaaki YURI
2nd Author's Affiliation Semiconductor Device Research Center, Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
3rd Author's Name Daisuke UEDA
3rd Author's Affiliation Semiconductor Device Research Center, Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
4th Author's Name Hiroyasu ISHIKAWA
4th Author's Affiliation Research Center for Nano-Device and System, Nagoya Institute of Technology
5th Author's Name Takashi EGAWA
5th Author's Affiliation Research Center for Nano-Device and System, Nagoya Institute of Technology
Date 2003/9/25
Paper # ED2003-140,CPM2003-110,LQE2003-58
Volume (vol) vol.103
Number (no) 343
Page pp.pp.-
#Pages 5
Date of Issue