Presentation 2003/7/25
Electrical properties and structure of titanium oxide thin films formed by metalorganic decomposition.
Shigeo TANAKA, Mikio WATANABE, Hisashi FUKUDA,
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Abstract(in English) High dielectric (high-k) thin films have attained considerable attention as possible replacements for dielectric insulators of sub-0.1 μm MOSFET in future ULSIs. Bulk TiO_2 has higher dielectric constant as compared to another high-k dielectric materials. Thus, TiO_2 is one of the expected high-k dielectric materials. However, leakage current of TiO_2 increased when the grain growth in the crystal becomes to proceed. Silicate could form thermally stable amorphous structure. Therefore, it was thought that silicate is able to overcome these problems. In this study, we have formed titanium-silicate thin films on a Si substrate by metalorganic decomposition (MOD). The crystal structure and the electrical properties of the films were investigated. Titanium silicate films could suppress leakage current caused by grain growth after high thermal annealing.
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Paper # CPM2003-69
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Conference Date 2003/7/25(1days)
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Language JPN
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Title (in English) Electrical properties and structure of titanium oxide thin films formed by metalorganic decomposition.
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1st Author's Name Shigeo TANAKA
1st Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering , Muroran Institute of Technology.()
2nd Author's Name Mikio WATANABE
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering , Muroran Institute of Technology.
3rd Author's Name Hisashi FUKUDA
3rd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering , Muroran Institute of Technology.
Date 2003/7/25
Paper # CPM2003-69
Volume (vol) vol.103
Number (no) 245
Page pp.pp.-
#Pages 6
Date of Issue