Presentation 2003/1/24
Low cost MMIC package for ultra high frequency signal transmission
Shinya Iijima, Yoshikatsu Ishizuki, Nobuyuki Hayashi, Masataka Mizukoshi, Satoshi Masuda, Toshihiro Shimura,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed a low-cost package technology to achieve high frequency signal transmission of over 100 GHz. This package consists of fine coaxial wirings fabricated with Cu-polyimide multi-layers. The fine coaxial wirings inside the package are capable of transmitting high frequency signals from MMIC (Monolithic Microwave Integrated Circuit) to PWB (Printed Wiring Board) with excellent elector-magnetic isolation of about 40 dB compared with the conventional alumina-ceramic packages.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Package for high frequency / MMIC / Fine coaxial wiring / Film interposer / Isolation
Paper # CPM2002-163
Date of Issue

Conference Information
Committee CPM
Conference Date 2003/1/24(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Low cost MMIC package for ultra high frequency signal transmission
Sub Title (in English)
Keyword(1) Package for high frequency
Keyword(2) MMIC
Keyword(3) Fine coaxial wiring
Keyword(4) Film interposer
Keyword(5) Isolation
1st Author's Name Shinya Iijima
1st Author's Affiliation FUJITSU LABORATORIES LTD.()
2nd Author's Name Yoshikatsu Ishizuki
2nd Author's Affiliation FUJITSU LABORATORIES LTD.
3rd Author's Name Nobuyuki Hayashi
3rd Author's Affiliation FUJITSU LABORATORIES LTD.
4th Author's Name Masataka Mizukoshi
4th Author's Affiliation FUJITSU LABORATORIES LTD.
5th Author's Name Satoshi Masuda
5th Author's Affiliation FUJITSU LABORATORIES LTD.
6th Author's Name Toshihiro Shimura
6th Author's Affiliation FUJITSU LABORATORIES LTD.
Date 2003/1/24
Paper # CPM2002-163
Volume (vol) vol.102
Number (no) 621
Page pp.pp.-
#Pages 5
Date of Issue