| Presentation | 2003/1/24 High-Performance FCBGA based on Multi-Layer Thin-Substrate Packaging Technology Tadanori SHIMOTO, Katsumi KIKUCHI, Hirokazu HONDA, Keiichiro KATA, Kazuhiro BABA, Koji MATSUI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We developed a high-performance FCBGA (Flip-Chip Ball Grid Array) based on Multi-Layer Thin-Substrate (MLTS) Packaging Technology in order to meet the strong demand for high-density, high-performance, and low-cost LSI Packages. The important feature is that, only a high-density, high-performance multi-layer thin-substrate structure remains by removing a metal plate after mounting an LSI chip. We successfully developed a high-density FCBGA prototype based on our MLTS packaging technology. The prototype's excellent long-term reliability was also demonstrated through a series of tests conducted on it. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | flip chip / BGA / high pin count / high density / multi layer / packaging substrate |
| Paper # | CPM2002-158 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2003/1/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | High-Performance FCBGA based on Multi-Layer Thin-Substrate Packaging Technology |
| Sub Title (in English) | |
| Keyword(1) | flip chip |
| Keyword(2) | BGA |
| Keyword(3) | high pin count |
| Keyword(4) | high density |
| Keyword(5) | multi layer |
| Keyword(6) | packaging substrate |
| 1st Author's Name | Tadanori SHIMOTO |
| 1st Author's Affiliation | Functional Materials Research Laboratories,NEC Corporation() |
| 2nd Author's Name | Katsumi KIKUCHI |
| 2nd Author's Affiliation | Functional Materials Research Laboratories,NEC Corporation |
| 3rd Author's Name | Hirokazu HONDA |
| 3rd Author's Affiliation | Packaging and Testing Engineering Division,NEC Electronics Corporation |
| 4th Author's Name | Keiichiro KATA |
| 4th Author's Affiliation | Packaging and Testing Engineering Division,NEC Electronics Corporation |
| 5th Author's Name | Kazuhiro BABA |
| 5th Author's Affiliation | Functional Materials Research Laboratories,NEC Corporation |
| 6th Author's Name | Koji MATSUI |
| 6th Author's Affiliation | Functional Materials Research Laboratories,NEC Corporation |
| Date | 2003/1/24 |
| Paper # | CPM2002-158 |
| Volume (vol) | vol.102 |
| Number (no) | 621 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |