Presentation 2003/1/22
A High-Speed Multi-Channel Test Fixture for Superconducting Integrated Circuit Chip
Masahiro AOYAGI, Katsuya KIKUCHI, Yuichiro SATO, Hiroshi NAKAGAWA, Hiroshi SATO, Kazuhiko TOKORO, Hiroshi AKOH,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have designed and fabricated a cryogenic test fixture for functional testing of digital and analogue superconducting integrated circuits (IC) in the GHz frequency range. The test fixture consists of a ball grid array (BGA) chip carrier, a detachable BGA socket, a coaxial printed wiring board, and 40 long coaxial cables with SMA connectors. The chip carrier has a microstrip wiring and solder balls. On the chip carrier, a superconducting IC chip is connected using Al wire bonding. The wiring board has a coaxial wiring structure. The wiring characteristic impedance of the chip carrier and the print wiring board was designed to be 50 Ω. In the BGA socket, the BGA chip carrier is electrically connected to the printed wiring board using anisotropic conductive rubber sheet. The coaxial cables are connected to the printed wiring board with soldering. All parts of the system were made with non-magnetic materials. The high frequency characteristics were partially evaluated by TDR measurement and S parameter measurement at 4.2K, 77K and room temperature.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Test Fixture / Cryogenic / Superconducting / Integrated Circuit
Paper # SCE2002-38
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Conference Information
Committee SCE
Conference Date 2003/1/22(1days)
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Paper Information
Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A High-Speed Multi-Channel Test Fixture for Superconducting Integrated Circuit Chip
Sub Title (in English)
Keyword(1) Test Fixture
Keyword(2) Cryogenic
Keyword(3) Superconducting
Keyword(4) Integrated Circuit
1st Author's Name Masahiro AOYAGI
1st Author's Affiliation Nano-electronics Institute(NeRI),National Institute of Advanced Industrial Science and Technology(AIST)()
2nd Author's Name Katsuya KIKUCHI
2nd Author's Affiliation Nano-electronics Institute(NeRI),National Institute of Advanced Industrial Science and Technology(AIST)
3rd Author's Name Yuichiro SATO
3rd Author's Affiliation R&D Division,Shinwa Corp.Ltd.
4th Author's Name Hiroshi NAKAGAWA
4th Author's Affiliation Nano-electronics Institute(NeRI),National Institute of Advanced Industrial Science and Technology(AIST)
5th Author's Name Hiroshi SATO
5th Author's Affiliation Nano-electronics Institute(NeRI),National Institute of Advanced Industrial Science and Technology(AIST)
6th Author's Name Kazuhiko TOKORO
6th Author's Affiliation Nano-electronics Institute(NeRI),National Institute of Advanced Industrial Science and Technology(AIST)
7th Author's Name Hiroshi AKOH
7th Author's Affiliation Nano-electronics Institute(NeRI),National Institute of Advanced Industrial Science and Technology(AIST)
Date 2003/1/22
Paper # SCE2002-38
Volume (vol) vol.102
Number (no) 612
Page pp.pp.-
#Pages 4
Date of Issue