Presentation 2004/6/11
A Design for 2-pattern Testability of System-on-Chip Interconnects
Yuusuke SAGA, Tomokazu YONEDA, Hideo FUJIWARA,
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Abstract(in English) Testing faults on interconnects of system-on-chip (SoC) has become more important because of high integration of semiconductors. The faults can be tested by 2-pattern testing. 2-pattern testing means application of consecutive two patterns and observation of one test sequence. In this paper, we present two DFT methods for 2-pattern testability of interconnect. One DFT method utilizes EXTEST mode of IEEE P1500 wrappers and support testing through serial TAM. Other doesn't use IEEE P1500 wrappers, and utilizes existing interconnects as much as possible. In a case study, we show advantages that hardware overhead of proposed method is lower than that of the DFT method based on consecutive testability.
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Keyword(in English) system-on-chip / interconnect / design for testability / crosstalk-induced faults / 2-pattern testability / test access mechanism
Paper # DC2004-10
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Committee DC
Conference Date 2004/6/11(1days)
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Registration To Dependable Computing (DC)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Design for 2-pattern Testability of System-on-Chip Interconnects
Sub Title (in English)
Keyword(1) system-on-chip
Keyword(2) interconnect
Keyword(3) design for testability
Keyword(4) crosstalk-induced faults
Keyword(5) 2-pattern testability
Keyword(6) test access mechanism
1st Author's Name Yuusuke SAGA
1st Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology Kansai Science City()
2nd Author's Name Tomokazu YONEDA
2nd Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology Kansai Science City
3rd Author's Name Hideo FUJIWARA
3rd Author's Affiliation Graduate School of Information Science, Nara Institute of Science and Technology Kansai Science City
Date 2004/6/11
Paper # DC2004-10
Volume (vol) vol.104
Number (no) 130
Page pp.pp.-
#Pages 6
Date of Issue