Presentation	2002/12/9 A Study on Reducing Heat Generation of On-Chip Packet Switches Takahiko YAMDA,
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Abstract(in English)	Communication infrastructure is now at a stake due to the penetration of the Internet and the mobile telephones. This paper presents a new version of connection-oriented infrastructure network which can be an interior network of the Internet, and an architecture of a system-on-a-chip node for it. Design crisis and heat generation neck will possibly limit the scale of the integration of on-chip packet switch node. The connection-based network will contributes to the resolution of the design crisis, and the proposed time-division start-and-stop operation of the on-chip will reduce average heat generation.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Next generation network / Packet transfer / System scale LSI / Low heat generation
Paper #	NS2002-186
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Conference Information
Committee	NS
Conference Date	2002/12/9(1days)
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Paper Information
Registration To	Network Systems(NS)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	A Study on Reducing Heat Generation of On-Chip Packet Switches
Sub Title (in English)
Keyword(1)	Next generation network
Keyword(2)	Packet transfer
Keyword(3)	System scale LSI
Keyword(4)	Low heat generation
1st Author's Name	Takahiko YAMDA
1st Author's Affiliation	Department of Computer Science, Ritsumeikan University()
Date	2002/12/9
Paper #	NS2002-186
Volume (vol)	vol.102
Number (no)	512
Page	pp.pp.-
#Pages	4
Date of Issue