Presentation | 2018-12-06 Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits LIU BAI, Takehiko Kikuchi, Takuya Mitarai, Nobuhiko Nishiyama, Hideki Yagi, Tomohiro Amemiya, Shigehisa Arai, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Hybrid / Photonic Integrated Circuits / Chip-on-Wafer / Plasma Activated Bonding / photoluminescence / stress |
Paper # | OPE2018-127,LQE2018-137,SIPH2018-43 |
Date of Issue | 2018-11-29 (OPE, LQE) |
Conference Information | |
Committee | LQE / OPE |
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Conference Date | 2018/12/6(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Keio University |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Photonic Device Workshop |
Chair | Kiichi Hamamoto(Kyusyu Univ.) / Kouki Sato(Furukawa Electric Industries) |
Vice Chair | Hiroshi Aruga(Mitsubishi Electric) / Hiroshi Takahashi(Sophia Univ.) |
Secretary | Hiroshi Aruga(SEI) / Hiroshi Takahashi(Furukawa Electric Industries) |
Assistant | Masaya Nagai(Osaka Univ.) / Yuya Shoji(Tokyo Inst. of Tech.) / Kazunori Seno(NTT) |
Paper Information | |
Registration To | Technical Committee on Lasers and Quantum Electronics / Technical Committee on OptoElectronics |
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Language | ENG-JTITLE |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits |
Sub Title (in English) | |
Keyword(1) | Hybrid |
Keyword(2) | Photonic Integrated Circuits |
Keyword(3) | Chip-on-Wafer |
Keyword(4) | Plasma Activated Bonding |
Keyword(5) | photoluminescence |
Keyword(6) | stress |
1st Author's Name | LIU BAI |
1st Author's Affiliation | Tokyo Institute of Technology(Tokyo Tech) |
2nd Author's Name | Takehiko Kikuchi |
2nd Author's Affiliation | Sumitomo Electric Industries, Ltd(SEI) |
3rd Author's Name | Takuya Mitarai |
3rd Author's Affiliation | Tokyo Institute of Technology(Tokyo Tech) |
4th Author's Name | Nobuhiko Nishiyama |
4th Author's Affiliation | Tokyo Institute of Technology(Tokyo Tech) |
5th Author's Name | Hideki Yagi |
5th Author's Affiliation | Sumitomo Electric Industries, Ltd(SEI) |
6th Author's Name | Tomohiro Amemiya |
6th Author's Affiliation | Tokyo Institute of Technology(Tokyo Tech) |
7th Author's Name | Shigehisa Arai |
7th Author's Affiliation | Tokyo Institute of Technology(Tokyo Tech) |
Date | 2018-12-06 |
Paper # | OPE2018-127,LQE2018-137,SIPH2018-43 |
Volume (vol) | vol.118 |
Number (no) | OPE-348,LQE-349,SIPH- |
Page | pp.pp.149-153(OPE), pp.149-153(LQE), pp.149-153(SIPH), |
#Pages | 5 |
Date of Issue | 2018-11-29 (OPE, LQE) |