Presentation 2018-12-06
Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
LIU BAI, Takehiko Kikuchi, Takuya Mitarai, Nobuhiko Nishiyama, Hideki Yagi, Tomohiro Amemiya, Shigehisa Arai,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Hybrid / Photonic Integrated Circuits / Chip-on-Wafer / Plasma Activated Bonding / photoluminescence / stress
Paper # OPE2018-127,LQE2018-137,SIPH2018-43
Date of Issue 2018-11-29 (OPE, LQE)

Conference Information
Committee LQE / OPE
Conference Date 2018/12/6(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Keio University
Topics (in Japanese) (See Japanese page)
Topics (in English) Photonic Device Workshop
Chair Kiichi Hamamoto(Kyusyu Univ.) / Kouki Sato(Furukawa Electric Industries)
Vice Chair Hiroshi Aruga(Mitsubishi Electric) / Hiroshi Takahashi(Sophia Univ.)
Secretary Hiroshi Aruga(SEI) / Hiroshi Takahashi(Furukawa Electric Industries)
Assistant Masaya Nagai(Osaka Univ.) / Yuya Shoji(Tokyo Inst. of Tech.) / Kazunori Seno(NTT)

Paper Information
Registration To Technical Committee on Lasers and Quantum Electronics / Technical Committee on OptoElectronics
Language ENG-JTITLE
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
Sub Title (in English)
Keyword(1) Hybrid
Keyword(2) Photonic Integrated Circuits
Keyword(3) Chip-on-Wafer
Keyword(4) Plasma Activated Bonding
Keyword(5) photoluminescence
Keyword(6) stress
1st Author's Name LIU BAI
1st Author's Affiliation Tokyo Institute of Technology(Tokyo Tech)
2nd Author's Name Takehiko Kikuchi
2nd Author's Affiliation Sumitomo Electric Industries, Ltd(SEI)
3rd Author's Name Takuya Mitarai
3rd Author's Affiliation Tokyo Institute of Technology(Tokyo Tech)
4th Author's Name Nobuhiko Nishiyama
4th Author's Affiliation Tokyo Institute of Technology(Tokyo Tech)
5th Author's Name Hideki Yagi
5th Author's Affiliation Sumitomo Electric Industries, Ltd(SEI)
6th Author's Name Tomohiro Amemiya
6th Author's Affiliation Tokyo Institute of Technology(Tokyo Tech)
7th Author's Name Shigehisa Arai
7th Author's Affiliation Tokyo Institute of Technology(Tokyo Tech)
Date 2018-12-06
Paper # OPE2018-127,LQE2018-137,SIPH2018-43
Volume (vol) vol.118
Number (no) OPE-348,LQE-349,SIPH-
Page pp.pp.149-153(OPE), pp.149-153(LQE), pp.149-153(SIPH),
#Pages 5
Date of Issue 2018-11-29 (OPE, LQE)