Presentation 2018-12-07
Analysis of Conductive Power Noise Characteristics in Digital IC Chips between two Different IC Packaging Structures
Akihiro Tsukioka, Kosuke Jike, Koh Watanabe, Noriyuki Miura, Makoto Nagata,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The conducted and radiated emission are caused by the dynamic power consumption in digital circuit operations. The characteristics of those emissions are associated to the power delivery network impedance for the electrical system. The package style has an impact on the power noise profiles. This paper describes and evaluates a simulation techniques for representing the on chip power noise for two IC packaging structures.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Dynamic power noise / Integrated circuit packaging / Electromagnetic interference / On chip monitor / Chip power model
Paper # CPM2018-96,ICD2018-57,IE2018-75
Date of Issue 2018-11-28 (CPM, ICD, IE)

Conference Information
Committee VLD / DC / CPSY / RECONF / CPM / ICD / IE / IPSJ-SLDM / IPSJ-EMB / IPSJ-ARC
Conference Date 2018/12/5(3days)
Place (in Japanese) (See Japanese page)
Place (in English) Satellite Campus Hiroshima
Topics (in Japanese) (See Japanese page)
Topics (in English) Design Gaia 2018 -New Field of VLSI Design-
Chair Noriyuki Minegishi(Mitsubishi Electric) / Satoshi Fukumoto(Tokyo Metropolitan Univ.) / Koji Nakano(Hiroshima Univ.) / Masato Motomura(Hokkaido Univ.) / Fumihiko Hirose(Yamagata Univ.) / Hideto Hidaka(Renesas) / Takayuki Hamamoto(Tokyo Univ. of Science) / Yutaka Tamiya(Fujitsu Laboratories) / 渡辺 晴美(東海大) / 井上 弘士(九大)
Vice Chair Nozomu Togawa(Waseda Univ.) / Hiroshi Takahashi(Ehime Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Takashi Miyoshi(Fujitsu) / Yuichiro Shibata(Nagasaki Univ.) / Kentaro Sano(RIKEN) / Mayumi Takeyama(Kitami Inst. of Tech.) / Makoto Nagata(Kobe Univ.) / Hideaki Kimata(NTT) / Kazuya Kodama(NII)
Secretary Nozomu Togawa(NTT) / Hiroshi Takahashi(Aizu Univ.) / Hidetsugu Irie(Tokyo Inst. of Tech.) / Takashi Miyoshi(Nihon Univ.) / Yuichiro Shibata(Utsunomiya Univ.) / Kentaro Sano(Hokkaido Univ.) / Mayumi Takeyama(Hiroshima City Univ.) / Makoto Nagata(e-trees.Japan) / Hideaki Kimata(Toyohashi Univ. of Tech.) / Kazuya Kodama(NTT) / (Panasonic) / (Tohoku Univ.) / (KDDI Research)
Assistant / / Yasuaki Ito(Hiroshima Univ.) / Tomoaki Tsumura(Nagoya Inst. of Tech.) / Yuuki Kobayashi(NEC) / Hiroki Nakahara(Tokyo Inst. of Tech.) / Yasuo Kimura(Tokyo Univ. of Tech.) / Hideki Nakazawa(Hirosaki Univ.) / Tomoaki Terasako(Ehime Univ.) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Masatoshi Tsuge(Socionext) / Tetsuya Hirose(Kobe Univ.) / Kazuya Hayase(NTT) / Yasutaka Matsuo(NHK) / Hiroe Iwasaki(NTT)

Paper Information
Registration To Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Component Parts and Materials / Technical Committee on Integrated Circuits and Devices / Technical Committee on Image Engineering / Special Interest Group on System and LSI Design Methodology / Special Interest Group on Embedded Systems / Special Interest Group on System Architecture
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Analysis of Conductive Power Noise Characteristics in Digital IC Chips between two Different IC Packaging Structures
Sub Title (in English)
Keyword(1) Dynamic power noise
Keyword(2) Integrated circuit packaging
Keyword(3) Electromagnetic interference
Keyword(4) On chip monitor
Keyword(5) Chip power model
1st Author's Name Akihiro Tsukioka
1st Author's Affiliation Kobe University(Kobe Univ.)
2nd Author's Name Kosuke Jike
2nd Author's Affiliation Kobe University(Kobe Univ.)
3rd Author's Name Koh Watanabe
3rd Author's Affiliation Kobe University(Kobe Univ.)
4th Author's Name Noriyuki Miura
4th Author's Affiliation Kobe University(Kobe Univ.)
5th Author's Name Makoto Nagata
5th Author's Affiliation Kobe University(Kobe Univ.)
Date 2018-12-07
Paper # CPM2018-96,ICD2018-57,IE2018-75
Volume (vol) vol.118
Number (no) CPM-336,ICD-337,IE-338
Page pp.pp.37-42(CPM), pp.37-42(ICD), pp.37-42(IE),
#Pages 6
Date of Issue 2018-11-28 (CPM, ICD, IE)