| Presentation | 2018-12-05 Horizontal Wireless Bus for Free-Form SiP Junichiro Kadomoto, Hidetsugu Irie, Shuichi Sakai, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We propose a wireless bus interface which connects chips integrated side by side wirelessly. Implementing large coils and transceiver circuits on each chip enables communication between multiple chips via horizontal inductive coupling. By using the proposed inter-chip communication technology and wireless power transmission technology in combination, wired connection between chips and between chips and a board is removed, and embedded systems with various shapes are realized. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | system-in-a-package (SiP) / inductive coupling / 3-D integration |
| Paper # | VLD2018-46,DC2018-32 |
| Date of Issue | 2018-11-28 (VLD, DC) |
| Conference Information | |
| Committee | VLD / DC / CPSY / RECONF / CPM / ICD / IE / IPSJ-SLDM / IPSJ-EMB / IPSJ-ARC |
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| Conference Date | 2018/12/5(3days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Satellite Campus Hiroshima |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Design Gaia 2018 -New Field of VLSI Design- |
| Chair | Noriyuki Minegishi(Mitsubishi Electric) / Satoshi Fukumoto(Tokyo Metropolitan Univ.) / Koji Nakano(Hiroshima Univ.) / Masato Motomura(Hokkaido Univ.) / Fumihiko Hirose(Yamagata Univ.) / Hideto Hidaka(Renesas) / Takayuki Hamamoto(Tokyo Univ. of Science) / Yutaka Tamiya(Fujitsu Laboratories) / 渡辺 晴美(東海大) / 井上 弘士(九大) |
| Vice Chair | Nozomu Togawa(Waseda Univ.) / Hiroshi Takahashi(Ehime Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Takashi Miyoshi(Fujitsu) / Yuichiro Shibata(Nagasaki Univ.) / Kentaro Sano(RIKEN) / Mayumi Takeyama(Kitami Inst. of Tech.) / Makoto Nagata(Kobe Univ.) / Hideaki Kimata(NTT) / Kazuya Kodama(NII) |
| Secretary | Nozomu Togawa(NTT) / Hiroshi Takahashi(Aizu Univ.) / Hidetsugu Irie(Tokyo Inst. of Tech.) / Takashi Miyoshi(Nihon Univ.) / Yuichiro Shibata(Utsunomiya Univ.) / Kentaro Sano(Hokkaido Univ.) / Mayumi Takeyama(Hiroshima City Univ.) / Makoto Nagata(e-trees.Japan) / Hideaki Kimata(Toyohashi Univ. of Tech.) / Kazuya Kodama(NTT) / (Panasonic) / (Tohoku Univ.) / (KDDI Research) |
| Assistant | / / Yasuaki Ito(Hiroshima Univ.) / Tomoaki Tsumura(Nagoya Inst. of Tech.) / Yuuki Kobayashi(NEC) / Hiroki Nakahara(Tokyo Inst. of Tech.) / Yasuo Kimura(Tokyo Univ. of Tech.) / Hideki Nakazawa(Hirosaki Univ.) / Tomoaki Terasako(Ehime Univ.) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Masatoshi Tsuge(Socionext) / Tetsuya Hirose(Kobe Univ.) / Kazuya Hayase(NTT) / Yasutaka Matsuo(NHK) / Hiroe Iwasaki(NTT) |
| Paper Information | |
| Registration To | Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Component Parts and Materials / Technical Committee on Integrated Circuits and Devices / Technical Committee on Image Engineering / Special Interest Group on System and LSI Design Methodology / Special Interest Group on Embedded Systems / Special Interest Group on System Architecture |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Horizontal Wireless Bus for Free-Form SiP |
| Sub Title (in English) | |
| Keyword(1) | system-in-a-package (SiP) |
| Keyword(2) | inductive coupling |
| Keyword(3) | 3-D integration |
| 1st Author's Name | Junichiro Kadomoto |
| 1st Author's Affiliation | The University of Tokyo(The Univ. of Tokyo) |
| 2nd Author's Name | Hidetsugu Irie |
| 2nd Author's Affiliation | The University of Tokyo(The Univ. of Tokyo) |
| 3rd Author's Name | Shuichi Sakai |
| 3rd Author's Affiliation | The University of Tokyo(The Univ. of Tokyo) |
| Date | 2018-12-05 |
| Paper # | VLD2018-46,DC2018-32 |
| Volume (vol) | vol.118 |
| Number (no) | VLD-334,DC-335 |
| Page | pp.pp.43-48(VLD), pp.43-48(DC), |
| #Pages | 6 |
| Date of Issue | 2018-11-28 (VLD, DC) |