講演名 | 2018-11-22 [Poster Presentation] Signal Integrity Analysis for High-speed Memory Test Interface using Data Capture PCB Hyesoo Kim(KAIST), Kyungjun Cho(KAIST), Seongguk Kim(KAIST), Joungho Kim(KAIST), |
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抄録(和) | In this paper, in high-speed graphic memory test interface, the trade-off relationship for electrical characteristic of the branch signal due to the branch structure and its degradation characteristics are analyzed in terms of signal integrity. A capture PCB is required in order to capture bit patterns for further failure analysis when GPU transmits signals to the high-speed graphic memory. The PCB is placed between prototype mother board and the memory. In the capture PCB, since signals are split into two, signal integrity is more degraded than before. Thus, this paper focuses on the reflection-analysis at the junction and discusses the trade-off among characteristics of received signal at the memory and captured signal depending on capture PCB design. |
抄録(英) | In this paper, in high-speed graphic memory test interface, the trade-off relationship for electrical characteristic of the branch signal due to the branch structure and its degradation characteristics are analyzed in terms of signal integrity. A capture PCB is required in order to capture bit patterns for further failure analysis when GPU transmits signals to the high-speed graphic memory. The PCB is placed between prototype mother board and the memory. In the capture PCB, since signals are split into two, signal integrity is more degraded than before. Thus, this paper focuses on the reflection-analysis at the junction and discusses the trade-off among characteristics of received signal at the memory and captured signal depending on capture PCB design. |
キーワード(和) | Signal integrity analysis / PCB design / memory test |
キーワード(英) | Signal integrity analysis / PCB design / memory test |
資料番号 | EMCJ2018-80 |
発行日 | 2018-11-15 (EMCJ) |
研究会情報 | |
研究会 | EMCJ / IEE-EMC / IEE-MAG |
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開催期間 | 2018/11/22(から2日開催) |
開催地(和) | KAIST(韓国大田市) |
開催地(英) | KAIST |
テーマ(和) | EMC Joint Workshop 2018, Daejon |
テーマ(英) | EMC Joint Workshop 2018, Daejon |
委員長氏名(和) | 和田 修己(京大) / 山崎 健一(電中研) / 山口 正洋(東北大) |
委員長氏名(英) | Osami Wada(Kyoto Univ.) / Ken-ichi Yamazaki(Central Research Institute of Electric Power Industory) / Masahiro Yamaguchi(Tohoku Univ.) |
副委員長氏名(和) | 王 建青(名工大) |
副委員長氏名(英) | Kensei Oh(Nagoya Inst. of Tech.) |
幹事氏名(和) | 青柳 貴洋(東工大) / 白木 康博(三菱電機) / 石上 忍(東北学院大) / 池畑 政輝(鉄道総研) / 小原 学(明治大) / 山田 啓壽(東芝) |
幹事氏名(英) | Takahiro Aoyagi(Tokyo Inst. of Tech.) / Yasuhiro Shiraki(Mitsubishi Electric) / Shinobu Ishigami(Tohoku Gakuin Univ.) / Masateru Ikehata(RTRI) / Gaku Obara(Meji Univ.) / Keiju Yamada(Toshiba Co.) |
幹事補佐氏名(和) | 長澤 忍(三菱電機) / 山本 真一郎(兵庫県立大) / 鵜生 高徳(デンソー) / 井渕 貴章(大阪大) |
幹事補佐氏名(英) | Shinobu Nagasawa(Mitsubishi Electric) / Shinichiro Yamamoto(Univ. of Hyogo) / Takanori Unou(Denso) / Takaaki Ibuchi(Osaka Univ.) |
講演論文情報詳細 | |
申込み研究会 | Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility / Technical Meeting on Magnetics |
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本文の言語 | ENG |
タイトル(和) | |
サブタイトル(和) | |
タイトル(英) | [Poster Presentation] Signal Integrity Analysis for High-speed Memory Test Interface using Data Capture PCB |
サブタイトル(和) | |
キーワード(1)(和/英) | Signal integrity analysis / Signal integrity analysis |
キーワード(2)(和/英) | PCB design / PCB design |
キーワード(3)(和/英) | memory test / memory test |
第 1 著者 氏名(和/英) | Hyesoo Kim / Hyesoo Kim |
第 1 著者 所属(和/英) | Korea Advanced Institute of Science and Technology(略称:KAIST) Korea Advanced Institute of Science and Technology(略称:KAIST) |
第 2 著者 氏名(和/英) | Kyungjun Cho / Kyungjun Cho |
第 2 著者 所属(和/英) | Korea Advanced Institute of Science and Technology(略称:KAIST) Korea Advanced Institute of Science and Technology(略称:KAIST) |
第 3 著者 氏名(和/英) | Seongguk Kim / Seongguk Kim |
第 3 著者 所属(和/英) | Korea Advanced Institute of Science and Technology(略称:KAIST) Korea Advanced Institute of Science and Technology(略称:KAIST) |
第 4 著者 氏名(和/英) | Joungho Kim / Joungho Kim |
第 4 著者 所属(和/英) | Korea Advanced Institute of Science and Technology(略称:KAIST) Korea Advanced Institute of Science and Technology(略称:KAIST) |
発表年月日 | 2018-11-22 |
資料番号 | EMCJ2018-80 |
巻番号(vol) | vol.118 |
号番号(no) | EMCJ-317 |
ページ範囲 | pp.63-63(EMCJ), |
ページ数 | 1 |
発行日 | 2018-11-15 (EMCJ) |