| Presentation | 2018-11-22 Power Distribution Network (PDN) Modeling of the Perforated Planes in A Silicon Interposer for High Bandwidth Memory (HBM) Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Joungho Kim, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In this paper, we first propose models of the power distribution network (PDN) of perforated power and ground (P/G) planes including substrate effects for a silicon interposer. Since it is almost impossible to simulate high-density perforated PDN structure, we suggest modeling methodology for perforated planes to reduce simulation time significantly with high accuracy. To obtain PDN impedance of silicon interposer faster, we convert the perforated planes to solid planes with a dielectric mixture. Previously, the basic air-filled structure of equivalent solid planes is designed from the EM simulation. The resistance (R) and inductance (L) of solid planes are similarly obtained by comparing those of perforated planes. Then, the capacitance (C) and conductance (G) of perforated planes are precisely calcaled based on the conformal mapping method. From the calculated C and G, the physical dimension and material properties of the dielectric mixture of solid planes are determined respectively. Because the PDN of a silicon interposer consists of a periodic structure, we design and analyze unit cell of PDN thoroughly. From the unit cell analysis, the electrical characteristic of an entire PDN can be successfully estimated. The PDN impedance of proposed solid and perforated planes and the simulation time to obtain each PDN impedance are compared evaluated respectively. The proposed methodology is validated by full 3-D electromagnetic (EM) simulation in the frequency range from 0.01 to 20 GHz. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Conformal mapping / High bandwidth memory / Power distribution network / Silicon interposer |
| Paper # | EMCJ2018-62 |
| Date of Issue | 2018-11-15 (EMCJ) |
| Conference Information | |
| Committee | EMCJ / IEE-EMC / IEE-MAG |
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| Conference Date | 2018/11/22(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | KAIST |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | EMC Joint Workshop 2018, Daejon |
| Chair | Osami Wada(Kyoto Univ.) / Ken-ichi Yamazaki(Central Research Institute of Electric Power Industory) / Masahiro Yamaguchi(Tohoku Univ.) |
| Vice Chair | Kensei Oh(Nagoya Inst. of Tech.) |
| Secretary | Kensei Oh(Tokyo Inst. of Tech.) / (Mitsubishi Electric) / (Tohoku Gakuin Univ.) |
| Assistant | Shinobu Nagasawa(Mitsubishi Electric) / Shinichiro Yamamoto(Univ. of Hyogo) / Takanori Unou(Denso) / Takaaki Ibuchi(Osaka Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility / Technical Meeting on Magnetics |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Power Distribution Network (PDN) Modeling of the Perforated Planes in A Silicon Interposer for High Bandwidth Memory (HBM) |
| Sub Title (in English) | |
| Keyword(1) | Conformal mapping |
| Keyword(2) | High bandwidth memory |
| Keyword(3) | Power distribution network |
| Keyword(4) | Silicon interposer |
| 1st Author's Name | Kyungjun Cho |
| 1st Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| 2nd Author's Name | Youngwoo Kim |
| 2nd Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| 3rd Author's Name | Subin Kim |
| 3rd Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| 4th Author's Name | Hyunwook Park |
| 4th Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| 5th Author's Name | Junyong Park |
| 5th Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| 6th Author's Name | Seongsoo Lee |
| 6th Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| 7th Author's Name | Joungho Kim |
| 7th Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
| Date | 2018-11-22 |
| Paper # | EMCJ2018-62 |
| Volume (vol) | vol.118 |
| Number (no) | EMCJ-317 |
| Page | pp.pp.21-21(EMCJ), |
| #Pages | 1 |
| Date of Issue | 2018-11-15 (EMCJ) |