Presentation | 2018-11-22 [Poster Presentation] High-Frequency Equivalent Circuit Model for High- Density Through-Silicon-Via Kibeom Kim, Seungyoung Ahn, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | |
Paper # | EMCJ2018-67 |
Date of Issue | 2018-11-15 (EMCJ) |
Conference Information | |
Committee | EMCJ / IEE-EMC / IEE-MAG |
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Conference Date | 2018/11/22(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | KAIST |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | EMC Joint Workshop 2018, Daejon |
Chair | Osami Wada(Kyoto Univ.) / Ken-ichi Yamazaki(Central Research Institute of Electric Power Industory) / Masahiro Yamaguchi(Tohoku Univ.) |
Vice Chair | Kensei Oh(Nagoya Inst. of Tech.) |
Secretary | Kensei Oh(Tokyo Inst. of Tech.) / (Mitsubishi Electric) / (Tohoku Gakuin Univ.) |
Assistant | Shinobu Nagasawa(Mitsubishi Electric) / Shinichiro Yamamoto(Univ. of Hyogo) / Takanori Unou(Denso) / Takaaki Ibuchi(Osaka Univ.) |
Paper Information | |
Registration To | Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility / Technical Meeting on Magnetics |
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Language | ENG |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | [Poster Presentation] High-Frequency Equivalent Circuit Model for High- Density Through-Silicon-Via |
Sub Title (in English) | |
Keyword(1) | |
1st Author's Name | Kibeom Kim |
1st Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
2nd Author's Name | Seungyoung Ahn |
2nd Author's Affiliation | Korea Advanced Institute of Science and Technology(KAIST) |
Date | 2018-11-22 |
Paper # | EMCJ2018-67 |
Volume (vol) | vol.118 |
Number (no) | EMCJ-317 |
Page | pp.pp.37-37(EMCJ), |
#Pages | 1 |
Date of Issue | 2018-11-15 (EMCJ) |