Presentation 2018-11-22
[Poster Presentation] High-Frequency Equivalent Circuit Model for High- Density Through-Silicon-Via
Kibeom Kim, Seungyoung Ahn,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # EMCJ2018-67
Date of Issue 2018-11-15 (EMCJ)

Conference Information
Committee EMCJ / IEE-EMC / IEE-MAG
Conference Date 2018/11/22(2days)
Place (in Japanese) (See Japanese page)
Place (in English) KAIST
Topics (in Japanese) (See Japanese page)
Topics (in English) EMC Joint Workshop 2018, Daejon
Chair Osami Wada(Kyoto Univ.) / Ken-ichi Yamazaki(Central Research Institute of Electric Power Industory) / Masahiro Yamaguchi(Tohoku Univ.)
Vice Chair Kensei Oh(Nagoya Inst. of Tech.)
Secretary Kensei Oh(Tokyo Inst. of Tech.) / (Mitsubishi Electric) / (Tohoku Gakuin Univ.)
Assistant Shinobu Nagasawa(Mitsubishi Electric) / Shinichiro Yamamoto(Univ. of Hyogo) / Takanori Unou(Denso) / Takaaki Ibuchi(Osaka Univ.)

Paper Information
Registration To Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility / Technical Meeting on Magnetics
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Poster Presentation] High-Frequency Equivalent Circuit Model for High- Density Through-Silicon-Via
Sub Title (in English)
Keyword(1)
1st Author's Name Kibeom Kim
1st Author's Affiliation Korea Advanced Institute of Science and Technology(KAIST)
2nd Author's Name Seungyoung Ahn
2nd Author's Affiliation Korea Advanced Institute of Science and Technology(KAIST)
Date 2018-11-22
Paper # EMCJ2018-67
Volume (vol) vol.118
Number (no) EMCJ-317
Page pp.pp.37-37(EMCJ),
#Pages 1
Date of Issue 2018-11-15 (EMCJ)