Presentation | 2018-11-01 Orientation control of Cu(111) on extremely thin barrier Mayumi B. Takeyama, Masaru Sato, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | In order to improve an electromaigration resistance, we examine the Cu grain orientation control on the thin barrier with good barrier properties. We demonstrate a highly oriented Cu(111) film on 5-nm-thick TaWN barrier even in the as-deposited Cu/TaWN/Si specimen. Moreover, the Cu/TaWN/Si system can keep stable up to the annealing at 700 ?C for 1 h without Ta- or Cu-silicides formation. We can obtain both the underlying material realizing the highly (111) oriented Cu interconnects and the diffusion barrier with sufficient barrier properties. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | LSI / Cu interconnects / TaWN film / diffusion barrier / Cu(111) orientation |
Paper # | CPM2018-46 |
Date of Issue | 2018-10-25 (CPM) |
Conference Information | |
Committee | CPM / IEE-MAG |
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Conference Date | 2018/11/1(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Machinaka campus Nagaoka |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Functional materials (semiconductors, magnetic materials, dielectric materials, transparent conductors, semiconductors, etc.) Thin film processes / materials / devices, etc. |
Chair | Fumihiko Hirose(Yamagata Univ.) / Masahiro Yamaguchi(Tohoku Univ.) |
Vice Chair | Mayumi Takeyama(Kitami Inst. of Tech.) / Gaku Ohara(Meiji Univ.) / Keiji Yamada(Toshiba) |
Secretary | Mayumi Takeyama(Toyohashi Univ. of Tech.) / Gaku Ohara(NTT) / Keiji Yamada |
Assistant | Yasuo Kimura(Tokyo Univ. of Tech.) / Hideki Nakazawa(Hirosaki Univ.) / Tomoaki Terasako(Ehime Univ.) |
Paper Information | |
Registration To | Technical Committee on Component Parts and Materials / Technical Meeting on Magnetics |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Orientation control of Cu(111) on extremely thin barrier |
Sub Title (in English) | |
Keyword(1) | LSI |
Keyword(2) | Cu interconnects |
Keyword(3) | TaWN film |
Keyword(4) | diffusion barrier |
Keyword(5) | Cu(111) orientation |
1st Author's Name | Mayumi B. Takeyama |
1st Author's Affiliation | Kitami Institute of Technology(Kitami Inst. of Tech) |
2nd Author's Name | Masaru Sato |
2nd Author's Affiliation | Kitami Institute of Technology(Kitami Inst. of Tech) |
Date | 2018-11-01 |
Paper # | CPM2018-46 |
Volume (vol) | vol.118 |
Number (no) | CPM-276 |
Page | pp.pp.25-28(CPM), |
#Pages | 4 |
Date of Issue | 2018-10-25 (CPM) |