Presentation | 2018-10-18 An analysis of transmission characteristics of a microstrip line at a ground defect in PCB Teruo Tobana, Yoji Isota, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | On the high density printed circuit board with a large elements, the effect of some ground slots, such as clearance halls of vias or ground defects, was concerned. In this paper, we studied a transmission characteristic of a line with a trace on a ground slot. We focused on the connecting point between the microstrip line and the trace on the ground slot. To consider not only the mismatch loss between lines but also the influence of the difference of line's structure, we used the F parameter of the connecting point. The F parameter at the connecting point was derived by the S parameter analyzed by FDTD method. By the values of the F parameter, we showed that the influence can be considered by an inductor with series connection and a capacitor with shunt connection. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | F parameter / ground slot / microstrip line |
Paper # | EMCJ2018-42,MW2018-78,EST2018-64 |
Date of Issue | 2018-10-11 (EMCJ, MW, EST) |
Conference Information | |
Committee | EST / MW / EMCJ / IEE-EMC |
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Conference Date | 2018/10/18(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Hachinohe Chamber of Commerce and Industry(Hachinohe city, Aomori) |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Simulation techniques, EMC, Microwave, Electromagnetic field simulation, etc. |
Chair | Akimasa Hirata(Nagoya Inst. of Tech.) / Masahiro Muraguchi(TUS) / Osami Wada(Kyoto Univ.) / 山崎 健一(電中研) |
Vice Chair | Shinichiro Ohnuki(Nihon Univ.) / Masayuki Kimishima(Advantest) / Jun Shibayama(Hosei Univ.) / Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(NTT DOCOMO) / Kenichi Tajima(Mitsubishi Electric) / Kensei Oh(Nagoya Inst. of Tech.) |
Secretary | Shinichiro Ohnuki(CIST) / Masayuki Kimishima(National Inst. of Tech.,Sendai College) / Jun Shibayama(HITACHI) / Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(Tokyo Inst. of Tech.) / Kenichi Tajima(Mitsubishi Electric) / Kensei Oh(東北学院大) / (鉄道総研) |
Assistant | Takahiro Ito(Nagoya Inst. of Tech.) / Kazuhiro Fujita(Fujitsu) / Mizuki Motoyoshi(Tohoku Univ.) / Satoshi Yoshida(Kagoshima Univ.) / Shinobu Nagasawa(Mitsubishi Electric) / Shinichiro Yamamoto(Univ. of Hyogo) / Takanori Unou(Denso) / 井渕 貴章(阪大) |
Paper Information | |
Registration To | Technical Committee on Electronics Simulation Technology / Technical Committee on Microwaves / Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility (IEE-EMC) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | An analysis of transmission characteristics of a microstrip line at a ground defect in PCB |
Sub Title (in English) | |
Keyword(1) | F parameter |
Keyword(2) | ground slot |
Keyword(3) | microstrip line |
1st Author's Name | Teruo Tobana |
1st Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
2nd Author's Name | Yoji Isota |
2nd Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
Date | 2018-10-18 |
Paper # | EMCJ2018-42,MW2018-78,EST2018-64 |
Volume (vol) | vol.118 |
Number (no) | EMCJ-247,MW-248,EST-249 |
Page | pp.pp.47-51(EMCJ), pp.47-51(MW), pp.47-51(EST), |
#Pages | 5 |
Date of Issue | 2018-10-11 (EMCJ, MW, EST) |