Presentation 2018-10-18
An analysis of transmission characteristics of a microstrip line at a ground defect in PCB
Teruo Tobana, Yoji Isota,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) On the high density printed circuit board with a large elements, the effect of some ground slots, such as clearance halls of vias or ground defects, was concerned. In this paper, we studied a transmission characteristic of a line with a trace on a ground slot. We focused on the connecting point between the microstrip line and the trace on the ground slot. To consider not only the mismatch loss between lines but also the influence of the difference of line's structure, we used the F parameter of the connecting point. The F parameter at the connecting point was derived by the S parameter analyzed by FDTD method. By the values of the F parameter, we showed that the influence can be considered by an inductor with series connection and a capacitor with shunt connection.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) F parameter / ground slot / microstrip line
Paper # EMCJ2018-42,MW2018-78,EST2018-64
Date of Issue 2018-10-11 (EMCJ, MW, EST)

Conference Information
Committee EST / MW / EMCJ / IEE-EMC
Conference Date 2018/10/18(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Hachinohe Chamber of Commerce and Industry(Hachinohe city, Aomori)
Topics (in Japanese) (See Japanese page)
Topics (in English) Simulation techniques, EMC, Microwave, Electromagnetic field simulation, etc.
Chair Akimasa Hirata(Nagoya Inst. of Tech.) / Masahiro Muraguchi(TUS) / Osami Wada(Kyoto Univ.) / 山崎 健一(電中研)
Vice Chair Shinichiro Ohnuki(Nihon Univ.) / Masayuki Kimishima(Advantest) / Jun Shibayama(Hosei Univ.) / Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(NTT DOCOMO) / Kenichi Tajima(Mitsubishi Electric) / Kensei Oh(Nagoya Inst. of Tech.)
Secretary Shinichiro Ohnuki(CIST) / Masayuki Kimishima(National Inst. of Tech.,Sendai College) / Jun Shibayama(HITACHI) / Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(Tokyo Inst. of Tech.) / Kenichi Tajima(Mitsubishi Electric) / Kensei Oh(東北学院大) / (鉄道総研)
Assistant Takahiro Ito(Nagoya Inst. of Tech.) / Kazuhiro Fujita(Fujitsu) / Mizuki Motoyoshi(Tohoku Univ.) / Satoshi Yoshida(Kagoshima Univ.) / Shinobu Nagasawa(Mitsubishi Electric) / Shinichiro Yamamoto(Univ. of Hyogo) / Takanori Unou(Denso) / 井渕 貴章(阪大)

Paper Information
Registration To Technical Committee on Electronics Simulation Technology / Technical Committee on Microwaves / Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility (IEE-EMC)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) An analysis of transmission characteristics of a microstrip line at a ground defect in PCB
Sub Title (in English)
Keyword(1) F parameter
Keyword(2) ground slot
Keyword(3) microstrip line
1st Author's Name Teruo Tobana
1st Author's Affiliation Akita Prefectural University(Akita Pref. Univ.)
2nd Author's Name Yoji Isota
2nd Author's Affiliation Akita Prefectural University(Akita Pref. Univ.)
Date 2018-10-18
Paper # EMCJ2018-42,MW2018-78,EST2018-64
Volume (vol) vol.118
Number (no) EMCJ-247,MW-248,EST-249
Page pp.pp.47-51(EMCJ), pp.47-51(MW), pp.47-51(EST),
#Pages 5
Date of Issue 2018-10-11 (EMCJ, MW, EST)