Presentation 2018-10-18
[Invited Talk] Promotion of Silicon Island in Kumamoto area and reconstruction from the earthquake disaster
Hiroshi Kubota,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) After the reconstruction from the Kumamoto earthquake disaster, I will return to the origin of industry-university collaborative research so far and will look at the direction of the Japanese semiconductor industry from the university side. How to create intellectual property and business outcomes at Kyushu Silicon Island and future directions of semiconductor joint research will be explained based on the Kumamoto system called the Trinity Collaborative Research Method.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Semiconductor / industry-academia cooperation / Kumamoto earthquake / Trinity Collaborative Research Method
Paper # SDM2018-63
Date of Issue 2018-10-10 (SDM)

Conference Information
Committee SDM
Conference Date 2018/10/17(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Niche, Tohoku Univ.
Topics (in Japanese) (See Japanese page)
Topics (in English) Process Science and New Process Technology
Chair Takahiro Shinada(Tohoku Univ.)
Vice Chair Hiroshige Hirano(TowerJazz Panasonic)
Secretary Hiroshige Hirano(Shizuoka Univ.)
Assistant Takahiro Mori(AIST) / Nobuaki Kobayashi(Nihon Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] Promotion of Silicon Island in Kumamoto area and reconstruction from the earthquake disaster
Sub Title (in English) How to develop Japanese semiconductor industry with academia collaboration
Keyword(1) Semiconductor
Keyword(2) industry-academia cooperation
Keyword(3) Kumamoto earthquake
Keyword(4) Trinity Collaborative Research Method
1st Author's Name Hiroshi Kubota
1st Author's Affiliation Kumamoto University(Kumamoto Univ.)
Date 2018-10-18
Paper # SDM2018-63
Volume (vol) vol.118
Number (no) SDM-241
Page pp.pp.57-61(SDM),
#Pages 5
Date of Issue 2018-10-10 (SDM)