Presentation | 2018-07-12 Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform Takeshi Matsumoto, Teruo Kurahashi, Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa, Ayahito Uetake, Kazumasa Takabayashi, Kazuhiro Ikeda, Hitoshi Kawashima, Suguru Akiyama, Shigeaki Sekiguchi, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for optical loss compensation of large-scale Si optical switches which are key devices in optical pass networks. For efficient coupling and large alignment tolerance, we adopted width-tapered spot-size converters (SSCs) on SOAs. On Si optical platforms, we used SiON dual-core SSCs for the coupling to SOAs. We developed precise flip-chip bonding (FCB) technologies of SOAs on Si optical platforms within 1-um alignment accuracy, and achieved in-line optical amplification of 15 dB and loss-less operation of 4x4 Si optical switches with SOA. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Silicon Photonics / Hybrid Integration / Flip-Chip Bonding / Silicon Optical Switch |
Paper # | LQE2018-23 |
Date of Issue | 2018-07-05 (LQE) |
Conference Information | |
Committee | LQE |
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Conference Date | 2018/7/12(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | Kiichi Hamamoto(Kyusyu Univ.) |
Vice Chair | Hiroshi Aruga(Mitsubishi Electric) |
Secretary | Hiroshi Aruga(SEI) |
Assistant | Masaya Nagai(Osaka Univ.) |
Paper Information | |
Registration To | Technical Committee on Lasers and Quantum Electronics |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform |
Sub Title (in English) | |
Keyword(1) | Silicon Photonics |
Keyword(2) | Hybrid Integration |
Keyword(3) | Flip-Chip Bonding |
Keyword(4) | Silicon Optical Switch |
1st Author's Name | Takeshi Matsumoto |
1st Author's Affiliation | Fujitsu Laboratories Ltd.(Fujitsu Lab) |
2nd Author's Name | Teruo Kurahashi |
2nd Author's Affiliation | Fujitsu Laboratories Ltd.(Fujitsu Lab) |
3rd Author's Name | Ryotaro Konoike |
3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
4th Author's Name | Keijiro Suzuki |
4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
5th Author's Name | Ken Tanizawa |
5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
6th Author's Name | Ayahito Uetake |
6th Author's Affiliation | Fujitsu Laboratories Ltd.(Fujitsu Lab) |
7th Author's Name | Kazumasa Takabayashi |
7th Author's Affiliation | Fujitsu Laboratories Ltd.(Fujitsu Lab) |
8th Author's Name | Kazuhiro Ikeda |
8th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
9th Author's Name | Hitoshi Kawashima |
9th Author's Affiliation | National Institute of Advanced Industrial Science and Technology(AIST) |
10th Author's Name | Suguru Akiyama |
10th Author's Affiliation | Fujitsu Laboratories Ltd.(Fujitsu Lab) |
11th Author's Name | Shigeaki Sekiguchi |
11th Author's Affiliation | Fujitsu Laboratories Ltd.(Fujitsu Lab) |
Date | 2018-07-12 |
Paper # | LQE2018-23 |
Volume (vol) | vol.118 |
Number (no) | LQE-129 |
Page | pp.pp.13-16(LQE), |
#Pages | 4 |
Date of Issue | 2018-07-05 (LQE) |