Presentation 2018-07-12
Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform
Takeshi Matsumoto, Teruo Kurahashi, Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa, Ayahito Uetake, Kazumasa Takabayashi, Kazuhiro Ikeda, Hitoshi Kawashima, Suguru Akiyama, Shigeaki Sekiguchi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for optical loss compensation of large-scale Si optical switches which are key devices in optical pass networks. For efficient coupling and large alignment tolerance, we adopted width-tapered spot-size converters (SSCs) on SOAs. On Si optical platforms, we used SiON dual-core SSCs for the coupling to SOAs. We developed precise flip-chip bonding (FCB) technologies of SOAs on Si optical platforms within 1-um alignment accuracy, and achieved in-line optical amplification of 15 dB and loss-less operation of 4x4 Si optical switches with SOA.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Silicon Photonics / Hybrid Integration / Flip-Chip Bonding / Silicon Optical Switch
Paper # LQE2018-23
Date of Issue 2018-07-05 (LQE)

Conference Information
Committee LQE
Conference Date 2018/7/12(2days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Kiichi Hamamoto(Kyusyu Univ.)
Vice Chair Hiroshi Aruga(Mitsubishi Electric)
Secretary Hiroshi Aruga(SEI)
Assistant Masaya Nagai(Osaka Univ.)

Paper Information
Registration To Technical Committee on Lasers and Quantum Electronics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform
Sub Title (in English)
Keyword(1) Silicon Photonics
Keyword(2) Hybrid Integration
Keyword(3) Flip-Chip Bonding
Keyword(4) Silicon Optical Switch
1st Author's Name Takeshi Matsumoto
1st Author's Affiliation Fujitsu Laboratories Ltd.(Fujitsu Lab)
2nd Author's Name Teruo Kurahashi
2nd Author's Affiliation Fujitsu Laboratories Ltd.(Fujitsu Lab)
3rd Author's Name Ryotaro Konoike
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
4th Author's Name Keijiro Suzuki
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
5th Author's Name Ken Tanizawa
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
6th Author's Name Ayahito Uetake
6th Author's Affiliation Fujitsu Laboratories Ltd.(Fujitsu Lab)
7th Author's Name Kazumasa Takabayashi
7th Author's Affiliation Fujitsu Laboratories Ltd.(Fujitsu Lab)
8th Author's Name Kazuhiro Ikeda
8th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
9th Author's Name Hitoshi Kawashima
9th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
10th Author's Name Suguru Akiyama
10th Author's Affiliation Fujitsu Laboratories Ltd.(Fujitsu Lab)
11th Author's Name Shigeaki Sekiguchi
11th Author's Affiliation Fujitsu Laboratories Ltd.(Fujitsu Lab)
Date 2018-07-12
Paper # LQE2018-23
Volume (vol) vol.118
Number (no) LQE-129
Page pp.pp.13-16(LQE),
#Pages 4
Date of Issue 2018-07-05 (LQE)