Presentation 2018-04-20
Improvement of quality factor of a spiral coil using a novel superconducting wire structure
Shinya Kobayashi, Naoto Sekiya,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed a structure consisting of two conventional REBCO wires that increases the quality factor of coils. The proposed structure is used to reduce the conductor loss of the Hastelloy substrate. The conductor losses of the skin effect of the wires were reduced by not using a copper stabilizer and silver overlayer. We investigated the effect of embedding the proposed structure in styrene foam on the coil quality factor and found that the foam reduced the quality factor due to its dielectric loss. We fabricated several different wire type spiral coils embedded in styrene foam and measured their quality factor at 300 and 77 K. The quality factor of the coil using the proposed structure was about 3.2 times that of one using copper wire at 300 K.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) wireless power transfer / spiral coil / REBCO coil / high temperature superconductors / quality factor
Paper # SCE2018-6
Date of Issue 2018-04-13 (SCE)

Conference Information
Committee SCE
Conference Date 2018/4/20(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Kikai-Shinko-Kaikan Bldg.
Topics (in Japanese) (See Japanese page)
Topics (in English) Devices, Thin film, etc.
Chair Hiroaki Myoren(Saitama Univ.)
Vice Chair
Secretary (National Defense Academy)
Assistant Hiroyuki Akaike(Daido Univ.)

Paper Information
Registration To Technical Committee on Superconductive Electronics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Improvement of quality factor of a spiral coil using a novel superconducting wire structure
Sub Title (in English)
Keyword(1) wireless power transfer
Keyword(2) spiral coil
Keyword(3) REBCO coil
Keyword(4) high temperature superconductors
Keyword(5) quality factor
1st Author's Name Shinya Kobayashi
1st Author's Affiliation University of Yamanashi(Yamanashi Univ.)
2nd Author's Name Naoto Sekiya
2nd Author's Affiliation University of Yamanashi(Yamanashi Univ.)
Date 2018-04-20
Paper # SCE2018-6
Volume (vol) vol.118
Number (no) SCE-11
Page pp.pp.29-32(SCE),
#Pages 4
Date of Issue 2018-04-13 (SCE)