Presentation | 2018-04-27 Wheel Insulation for Via- Wheel Power Transfer Structure Yudai Shibata, Naoki Sakai, Takashi Ohira, |
---|---|
PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This paper proposes a wheel insulated via-wheel power transfer structure for electric vehicle on electrified roadway. The structure is composed of wheel insulation mechanism and drum collector mechanism. Wheel insulation mechanism is made of a two-piece wheel that has a rim and a disc. The rim is made from aluminum and the disc is made from glass fiber reinforced plastics. Drum collector mechanism has an electrode that is shape to go around a drum brake. Power received from the electrified road to the rim is transmitted to the in-vehicle circuit by drum collector mechanism using electric field coupling between the rim and an electrode. Wheel insulation mechanism insulates the rim and the metal body at high frequency by the disc, and mitigates power loss in the metal body. We implemented wheel insulation mechanism and drum collector mechanism into a small electric vehicle. The maximum effective transmission efficiency calculated from the measured S parameter of the via-wheel power transfer with the structure mounted reaches 92.8 %. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Electric vehicle / Wireless power transfer / Capacitive coupling / EVER / V-WPT |
Paper # | WPT2018-8,MW2018-8 |
Date of Issue | 2018-04-20 (WPT, MW) |
Conference Information | |
Committee | MW / WPT |
---|---|
Conference Date | 2018/4/27(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Kikai-Shinko-Kaikan Building |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Wireless Power Transfer / microwave, general |
Chair | Masahiro Muraguchi(TUC) / Chenq Kiyou(Tohoku Univ.) |
Vice Chair | Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(NTTdocomo) / Kenichi Tajima(Mitsubishi Electric) / Tomohiro Seki(Nihon Univ.) |
Secretary | Yoshinori Kogami(Tokyo Inst. of Tech.) / Hiroshi Okazaki(HITACHI) / Kenichi Tajima(Nagoya Inst. of Tech.) / Tomohiro Seki(Hokkaido Univ.) |
Assistant | Satoshi Ono(Univ. of Electro-Comm.) / Mizuki Motoyoshi(Tohoku Univ.) / Takehiro Imura(Univ. of Tokyo) / Masahiro Hanazawa(UL Japan) |
Paper Information | |
Registration To | Technical Committee on Microwaves / Technical Committee on Wireless Power Transfer |
---|---|
Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Wheel Insulation for Via- Wheel Power Transfer Structure |
Sub Title (in English) | |
Keyword(1) | Electric vehicle |
Keyword(2) | Wireless power transfer |
Keyword(3) | Capacitive coupling |
Keyword(4) | EVER |
Keyword(5) | V-WPT |
1st Author's Name | Yudai Shibata |
1st Author's Affiliation | Toyohashi University of Technology(TUT) |
2nd Author's Name | Naoki Sakai |
2nd Author's Affiliation | Toyohashi University of Technology(TUT) |
3rd Author's Name | Takashi Ohira |
3rd Author's Affiliation | Toyohashi University of Technology(TUT) |
Date | 2018-04-27 |
Paper # | WPT2018-8,MW2018-8 |
Volume (vol) | vol.118 |
Number (no) | WPT-17,MW-18 |
Page | pp.pp.37-40(WPT), pp.37-40(MW), |
#Pages | 4 |
Date of Issue | 2018-04-20 (WPT, MW) |