Presentation 2018-02-28
Development of Loop Flattening Tool that Reduces Cycle Overhead in Loop Pipelining of Nested Loops in High Level Synthesis
Daisuke Ishikawa, Kenshu Seto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We develop a loop flattening tool for designing hardware with high level synthesis. When loop pipelining is applied to nested for-loops, the overhead in the number of execution cycles occurs. Loop flattening is one of the ways to reduce this overhead. At least three loop flattening method exists, so it is necessary to manually select the optimal one for a given nested loop. In order to facilitate this selection, we propose an automatic flow of loop flattening. In this paper, we experimentally evaluate the three loop flattening method and derive the criteria to select the best loop flattening method from the three for a given loop nest.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) High-Level Synthesis / Loop Flattening / LLVM
Paper # VLD2017-97
Date of Issue 2018-02-21 (VLD)

Conference Information
Committee VLD / HWS
Conference Date 2018/2/28(3days)
Place (in Japanese) (See Japanese page)
Place (in English) Okinawa Seinen Kaikan
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Hiroyuki Ochi(Ritsumeikan Univ.)
Vice Chair Noriyuki Minegishi(Mitsubishi Electric)
Secretary Noriyuki Minegishi(Hiroshima City Univ.) / (NTT)
Assistant

Paper Information
Registration To Technical Committee on VLSI Design Technologies / Technical Committee on Hardware Security
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of Loop Flattening Tool that Reduces Cycle Overhead in Loop Pipelining of Nested Loops in High Level Synthesis
Sub Title (in English)
Keyword(1) High-Level Synthesis
Keyword(2) Loop Flattening
Keyword(3) LLVM
1st Author's Name Daisuke Ishikawa
1st Author's Affiliation Tokyo City University(TCU)
2nd Author's Name Kenshu Seto
2nd Author's Affiliation Tokyo City University(TCU)
Date 2018-02-28
Paper # VLD2017-97
Volume (vol) vol.117
Number (no) VLD-455
Page pp.pp.49-54(VLD),
#Pages 6
Date of Issue 2018-02-21 (VLD)