Presentation	2018-03-16 Far end crosstalk reduction technique by adding capacitance on the solder resist Daisuke Kihara, Shinnichi Sasaki,
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Abstract(in Japanese)	(See Japanese page)
Abstract(in English)
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)
Paper #	EMCJ2017-108
Date of Issue	2018-03-09 (EMCJ)

Conference Information
Committee	EMCJ / MICT
Conference Date	2018/3/16(1days)
Place (in Japanese)	(See Japanese page)
Place (in English)	Kikai-Shinko-Kaikan Bldg.
Topics (in Japanese)	(See Japanese page)
Topics (in English)	EMC
Chair	Osami Wada(Kyoto Univ.) / Masaru Sugimachi(National Cerebral and Cardiovascular Center)
Vice Chair	Kensei Oh(Nagoya Inst. of Tech.) / Shinsuke Hara(Osaka City Univ.) / Takahiro Aoyagi(Tokyo Inst. of Tech.)
Secretary	Kensei Oh(AIST) / Shinsuke Hara(Mitsubishi Electric) / Takahiro Aoyagi(Niigata Univ.)
Assistant	Shinichiro Yamamoto(Univ. of Hyogo) / Chie Sasaki(Panasonic) / Shinobu Nagasawa(Mitsubishi Electric) / Takumi Kobayashi(Yokohama National Univ.) / Shintaro Izumi(Kobe Univ.) / Tomoko Tateyama(Hiroshima Inst. of Tech.) / Ami Tanaka(Ritsumeikan Univ.) / Daisuke Anzai(Nagoya Inst. of Tech.)

Paper Information
Registration To	Technical Committee on Electromagnetic Compatibility / Technical Committee on Healthcare and Medical Information Communication Technology
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Far end crosstalk reduction technique by adding capacitance on the solder resist
Sub Title (in English)
Keyword(1)
1st Author's Name	Daisuke Kihara
1st Author's Affiliation	Saga University(Saga Univ.)
2nd Author's Name	Shinnichi Sasaki
2nd Author's Affiliation	Saga University(Saga Univ.)
Date	2018-03-16
Paper #	EMCJ2017-108
Volume (vol)	vol.117
Number (no)	EMCJ-510
Page	pp.pp.19-23(EMCJ),
#Pages	5
Date of Issue	2018-03-09 (EMCJ)