Presentation 2018-02-20
Testing the Bridge Interconnect Fault for Memory based Reconfigurable Logic Device (MRLD)
Senling Wang, Tatsuya Ogawa, Yoshinobu Higami, Hiroshi Takahashi, Masayuki Sato, Mitsunori Katsu, Shoichi Sekiguchi,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) MRLD is a promising alternative to FPGA with the benefits of low production cost, low power and small delay. In order to improve the yield and reliability of MRLD, in [6] we have developed the test approaches for detecting the interconnect faults including the stuck-at and bridge faults of MRLD. However, the test method for bridge faults of MRLD presented in [6] did not consider possible bridges between any interconnects in MRLD. Therefore, in this paper, we improve the test method of [6] for detecting the bridge faults between any interconnects that takes the Place-and-Route into account. The experimental results confirmed the effectiveness of the proposed test method.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Reconfigurable Device / MRLD / FPGA / Reliability / Interconnect defects / Testing
Paper # DC2017-87
Date of Issue 2018-02-13 (DC)

Conference Information
Committee DC
Conference Date 2018/2/20(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Kikai-Shinko-Kaikan Bldg.
Topics (in Japanese) (See Japanese page)
Topics (in English) VLSI Design and Test, etc.
Chair Michiko Inoue(NAIST)
Vice Chair Satoshi Fukumoto(Tokyo Metropolitan Univ.)
Secretary Satoshi Fukumoto(Kyoto Sangyo Univ.)
Assistant Masayuki Arai(Nihon Univ.)

Paper Information
Registration To Technical Committee on Dependable Computing
Language ENG-JTITLE
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Testing the Bridge Interconnect Fault for Memory based Reconfigurable Logic Device (MRLD)
Sub Title (in English)
Keyword(1) Reconfigurable Device
Keyword(2) MRLD
Keyword(3) FPGA
Keyword(4) Reliability
Keyword(5) Interconnect defects
Keyword(6) Testing
1st Author's Name Senling Wang
1st Author's Affiliation Ehime University(Ehime Univ.)
2nd Author's Name Tatsuya Ogawa
2nd Author's Affiliation Ehime University(Ehime Univ.)
3rd Author's Name Yoshinobu Higami
3rd Author's Affiliation Ehime University(Ehime Univ.)
4th Author's Name Hiroshi Takahashi
4th Author's Affiliation Ehime University(Ehime Univ.)
5th Author's Name Masayuki Sato
5th Author's Affiliation TRL Corp.(TRL)
6th Author's Name Mitsunori Katsu
6th Author's Affiliation TRL Corp.(TRL)
7th Author's Name Shoichi Sekiguchi
7th Author's Affiliation TAIYOYUDEN(TAIYOYUDEN)
Date 2018-02-20
Paper # DC2017-87
Volume (vol) vol.117
Number (no) DC-444
Page pp.pp.61-66(DC),
#Pages 6
Date of Issue 2018-02-13 (DC)