| Presentation | 2018-02-28 Construction of simulation for analyzing thermal conduction in nanostructures Naomi Yamashita, Yuya Ota, Ryo Nanao, Hiroshi Inokawa, Masaru Shimomura, Kenji Murakami, Hiroya Ikeda, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructed a new measurement system based on ac calorimetry. Analysis of the obtained data requires time-evolution of temperature distribution in nanometer-scale material under periodic heating. In this study, we made a simulation using a C#-program for time-dependent temperature distribution, based on 2-dimensional heat-diffusion equation including the influence of heat emission from material edges. The simulation was applied to AlN with millimeter-scale dimensions for confirming the validity and accuracy. The simulated thermal diffusivity for 10$times$75-mm$^{2}$-area AlN was 1.3x10^-4 m^2/s, which was larger than the value set in the heat-diffusion equation. This overestimation was also observed in the experiment. Therefore, our simulation can reproduce the unsteady heat conduction and be used for analyzing the ac calorimetry experiment. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | thermal diffusivity / ac calorimetry / heat diffusion equation / AlN |
| Paper # | ED2017-112,SDM2017-112 |
| Date of Issue | 2018-02-21 (ED, SDM) |
| Conference Information | |
| Committee | ED / SDM |
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| Conference Date | 2018/2/28(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Centennial Hall, Hokkaido Univ. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Functional nanodevices and related technologies |
| Chair | Kunio Tsuda(Toshiba) / Tatsuya Kunikiyo(Renesas) |
| Vice Chair | Michihiko Suhara(TMU) / Takahiro Shinada(Tohoku Univ.) |
| Secretary | Michihiko Suhara(New JRC) / Takahiro Shinada(NICT) |
| Assistant | Toshiyuki Oishi(Saga Univ.) / Tatsuya Iwata(TUT) / Hiroya Ikeda(Shizuoka Univ.) / Tetsu Morooka(TOSHIBA MEMORY) |
| Paper Information | |
| Registration To | Technical Committee on Electron Devices / Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Construction of simulation for analyzing thermal conduction in nanostructures |
| Sub Title (in English) | |
| Keyword(1) | thermal diffusivity |
| Keyword(2) | ac calorimetry |
| Keyword(3) | heat diffusion equation |
| Keyword(4) | AlN |
| 1st Author's Name | Naomi Yamashita |
| 1st Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| 2nd Author's Name | Yuya Ota |
| 2nd Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| 3rd Author's Name | Ryo Nanao |
| 3rd Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| 4th Author's Name | Hiroshi Inokawa |
| 4th Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| 5th Author's Name | Masaru Shimomura |
| 5th Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| 6th Author's Name | Kenji Murakami |
| 6th Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| 7th Author's Name | Hiroya Ikeda |
| 7th Author's Affiliation | Shizuoka University(Shizuoka Univ.) |
| Date | 2018-02-28 |
| Paper # | ED2017-112,SDM2017-112 |
| Volume (vol) | vol.117 |
| Number (no) | ED-453,SDM-454 |
| Page | pp.pp.35-38(ED), pp.35-38(SDM), |
| #Pages | 4 |
| Date of Issue | 2018-02-21 (ED, SDM) |