| Presentation | 2017-12-14 Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter Yuki Karasawa, Yusuke Gotou, Shintaro Hara, Takanobu Fukuoka, Kousuke Miyaji, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This work compares high frequency hysteretic buck converters implemented by chip-on-board wire bonding and flip-chip bonding in terms of efficiency, switching frequency and operation stability. The converters have been implemented in a standard 0.35 {mu}m CMOS process using 5 V IO transistors. 5 ~ 30 MHz operation is demonstrated with 88.5 % efficiency at 2.8 W output in the flip-chip bonding sample and 87.1 % at 2.7 W in the wire bonding sample. However, unstable oscillation and non-periodic spikes of output voltage are observed in the wire bonding sample. The simulations show that the noise induced by the bonding wire impedance is injected to the input of the hysteretic comparator causing the unstable oscillation. The flip-chip bonding sample shows 1.0 ~ 1.5 % higher efficiency and stable oscillation compared with the wire bonding sample. Flip-chip bonding is essential for efficient and stable high frequency DC-DC converter operation. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | wire bonding / flip-chip bonding / DC-DC converter |
| Paper # | CAS2017-92,ICD2017-80,CPSY2017-89 |
| Date of Issue | 2017-12-07 (CAS, ICD, CPSY) |
| Conference Information | |
| Committee | ICD / CPSY / CAS |
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| Conference Date | 2017/12/14(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Art Hotel Ishigakijima |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Hideto Hidaka(Renesas) / Koji Nakano(Hiroshima Univ.) / Mitsuru Hiraki(Renesas) |
| Vice Chair | Makoto Nagata(Kobe Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Takashi Miyoshi(Fujitsu) / Hideaki Okazaki(Shonan Inst. of Tech.) |
| Secretary | Makoto Nagata(Univ. of Tokyo) / Hidetsugu Irie(Panasonic) / Takashi Miyoshi(Utsunomiya Univ.) / Hideaki Okazaki(Hokkaido Univ.) |
| Assistant | Masanori Natsui(Tohoku Univ.) / Masatoshi Tsuge(Socionext) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Pham Konkuha(Univ. of Electro-Comm.) / Yasuaki Ito(Hiroshima Univ.) / Tomoaki Tsumura(Nagoya Inst. of Tech.) / Yohei Nakamura(Hitachi) |
| Paper Information | |
| Registration To | Technical Committee on Integrated Circuits and Devices / Technical Committee on Computer Systems / Technical Committee on Circuits and Systems |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter |
| Sub Title (in English) | |
| Keyword(1) | wire bonding |
| Keyword(2) | flip-chip bonding |
| Keyword(3) | DC-DC converter |
| 1st Author's Name | Yuki Karasawa |
| 1st Author's Affiliation | Shinshu University(Shinshu Univ.) |
| 2nd Author's Name | Yusuke Gotou |
| 2nd Author's Affiliation | Shinshu University(Shinshu Univ.) |
| 3rd Author's Name | Shintaro Hara |
| 3rd Author's Affiliation | Shinshu University(Shinshu Univ.) |
| 4th Author's Name | Takanobu Fukuoka |
| 4th Author's Affiliation | Shinshu University(Shinshu Univ.) |
| 5th Author's Name | Kousuke Miyaji |
| 5th Author's Affiliation | Shinshu University(Shinshu Univ.) |
| Date | 2017-12-14 |
| Paper # | CAS2017-92,ICD2017-80,CPSY2017-89 |
| Volume (vol) | vol.117 |
| Number (no) | CAS-343,ICD-344,CPSY-345 |
| Page | pp.pp.129-129(CAS), pp.129-129(ICD), pp.129-129(CPSY), |
| #Pages | 1 |
| Date of Issue | 2017-12-07 (CAS, ICD, CPSY) |