| Presentation | 2017-11-07 Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules Akihiro Tsukioka, Makoto Nagata, Kohki Taniguchi, Daisuke Fujimoto, Rieko Akimoto, Takao Egami, Kenji Niinomi, Takeshi Yuhara, Sachio Hayashi, Rob Mathews, Karthik Srinivasan, Ying-Shiun Li, Norman Chang, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In recent years, electromagnetic compatibility (EMC) becomes a major concern among IC chips. EMC is characterized in two directions. Electromagnetic emission (EMI) is the noise generated by the operation of the device. EMI cause noise to propagate through the power traces or air and interfere with other devices. Electromagnetic susceptibility (EMS) is the noise tolerance of IC chip. Direct power injection (DPI) method is standardized in IEC62132-4 for EMS testing. We designed the local interconnect network (LIN) test chip in a 0.13 nm BiCD process, and compared the simulated and measured attenuation of propagating noise of DPI test. The chip-package-system (CPS) board analysis including the extended chip power model (ECPM) predicts the RF noise coupling injected the EMS test. This results benefit ICs designers grasp the root cause of EMS. Keywords Electromagnetic susceptibility, Electromagnetic immunity, Substrate coupling, Power delivery network, Direct power injection, Extended chip power model, Local interconnect network |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electromagnetic susceptibility / Electromagnetic immunity / Substrate coupling / Power delivery network / Direct power injection / Extended chip power model / Local interconnect network |
| Paper # | CPM2017-84,ICD2017-43,IE2017-69 |
| Date of Issue | 2017-10-30 (CPM, ICD, IE) |
| Conference Information | |
| Committee | VLD / DC / CPSY / RECONF / CPM / ICD / IE / IPSJ-SLDM / IPSJ-EMB / IPSJ-ARC |
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| Conference Date | 2017/11/6(3days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kumamoto-Kenminkouryukan Parea |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Design Gaia 2017 -New Field of VLSI Design- |
| Chair | Hiroyuki Ochi(Ritsumeikan Univ.) / Michiko Inoue(NAIST) / Koji Nakano(Hiroshima Univ.) / Masato Motomura(Hokkaido Univ.) / Fumihiko Hirose(Yamagata Univ.) / Hideto Hidaka(Renesas) / Takayuki Hamamoto(Tokyo Univ. of Science) / Kiyoharu Hamaguchi(Shimane Univ.) / 渡辺 晴美(東海大) / Masahiro Goshima(NII) |
| Vice Chair | Noriyuki Minegishi(Mitsubishi Electric) / Satoshi Fukumoto(Tokyo Metropolitan Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Takashi Miyoshi(Fujitsu) / Yuichiro Shibata(Nagasaki Univ.) / Kentaro Sano(Tohoku Univ.) / Mayumi Takeyama(Kitami Inst. of Tech.) / Makoto Nagata(Kobe Univ.) / Kazuya Kodama(NII) / Hideaki Kimata(NTT) |
| Secretary | Noriyuki Minegishi(Hiroshima City Univ.) / Satoshi Fukumoto(NTT) / Hidetsugu Irie(Kyoto Sangyo Univ.) / Takashi Miyoshi(Tokyo Inst. of Tech.) / Yuichiro Shibata(Utsunomiya Univ.) / Kentaro Sano(Hokkaido Univ.) / Mayumi Takeyama(Hiroshima City Univ.) / Makoto Nagata(e-trees.Japan) / Kazuya Kodama(Nihon Univ.) / Hideaki Kimata(Toyohashi Univ. of Tech.) / (Univ. of Tokyo) / (Panasonic) / (Nagoya Univ.) |
| Assistant | / Masayuki Arai(Nihon Univ.) / Yasuaki Ito(Hiroshima Univ.) / Tomoaki Tsumura(Nagoya Inst. of Tech.) / Yuuki Kobayashi(NEC) / Hiroki Nakahara(Tokyo Inst. of Tech.) / Yuichi Akage(NTT) / Masanori Natsui(Tohoku Univ.) / Masatoshi Tsuge(Socionext) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Pham Konkuha(Univ. of Electro-Comm.) / Yasutaka Matsuo(NHK) / Kazuya Hayase(NTT) |
| Paper Information | |
| Registration To | Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Component Parts and Materials / Technical Committee on Integrated Circuits and Devices / Technical Committee on Image Engineering / Special Interest Group on System and LSI Design Methodology / Special Interest Group on Embedded Systems / Special Interest Group on System Architecture |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules |
| Sub Title (in English) | |
| Keyword(1) | Electromagnetic susceptibility |
| Keyword(2) | Electromagnetic immunity |
| Keyword(3) | Substrate coupling |
| Keyword(4) | Power delivery network |
| Keyword(5) | Direct power injection |
| Keyword(6) | Extended chip power model |
| Keyword(7) | Local interconnect network |
| Keyword(8) | |
| 1st Author's Name | Akihiro Tsukioka |
| 1st Author's Affiliation | Kobe University(Kobe Univ.) |
| 2nd Author's Name | Makoto Nagata |
| 2nd Author's Affiliation | Kobe University(Kobe Univ.) |
| 3rd Author's Name | Kohki Taniguchi |
| 3rd Author's Affiliation | Kobe University(Kobe Univ.) |
| 4th Author's Name | Daisuke Fujimoto |
| 4th Author's Affiliation | Kobe University(Kobe Univ.) |
| 5th Author's Name | Rieko Akimoto |
| 5th Author's Affiliation | Toshiba Corporation(TOSHIBA) |
| 6th Author's Name | Takao Egami |
| 6th Author's Affiliation | Toshiba Corporation(TOSHIBA) |
| 7th Author's Name | Kenji Niinomi |
| 7th Author's Affiliation | Toshiba Corporation(TOSHIBA) |
| 8th Author's Name | Takeshi Yuhara |
| 8th Author's Affiliation | Toshiba Corporation(TOSHIBA) |
| 9th Author's Name | Sachio Hayashi |
| 9th Author's Affiliation | Toshiba Corporation(TOSHIBA) |
| 10th Author's Name | Rob Mathews |
| 10th Author's Affiliation | Semiconductor BU, ANSYS Inc.(ANSYS) |
| 11th Author's Name | Karthik Srinivasan |
| 11th Author's Affiliation | Semiconductor BU, ANSYS Inc.(ANSYS) |
| 12th Author's Name | Ying-Shiun Li |
| 12th Author's Affiliation | Semiconductor BU, ANSYS Inc.(ANSYS) |
| 13th Author's Name | Norman Chang |
| 13th Author's Affiliation | Semiconductor BU, ANSYS Inc.(ANSYS) |
| Date | 2017-11-07 |
| Paper # | CPM2017-84,ICD2017-43,IE2017-69 |
| Volume (vol) | vol.117 |
| Number (no) | CPM-275,ICD-276,IE-277 |
| Page | pp.pp.27-32(CPM), pp.27-32(ICD), pp.27-32(IE), |
| #Pages | 6 |
| Date of Issue | 2017-10-30 (CPM, ICD, IE) |