Presentation | 2017-11-09 [Invited Talk] Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air Ryo Takigawa, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | As an alternative to conventional AuSn solder bonding, we have developed low-temperature solid-state bonding method of Au for high-density packaging of optical components. In this presentation, we report passive alignment and mounting of lithium niobate (LiNbO3) optical waveguide chips on Si substrates using surface activated low-temperature bonding with Au microbumps. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Packaging of LiNbO3 optical device / Passive alignment / LiNbO3-Si bonding / Low-temperature bonding / Au microbump / Hybrid integration |
Paper # | MWP2017-46 |
Date of Issue | 2017-11-02 (MWP) |
Conference Information | |
Committee | MWP |
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Conference Date | 2017/11/9(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Kikai-Shinko-Kaikan Bldg. |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | Device, MWP-related topics, etc |
Chair | Tetsuya Kawanishi(Waseda Univ.) |
Vice Chair | Naoto Yoshimoto(Chitose Inst. of Science and Tech.) |
Secretary | Naoto Yoshimoto(NICT) |
Assistant | Kosuke Nishimura(KDDI) / Kensuke Ikeda(CRIEPI) |
Paper Information | |
Registration To | Technical Committee on Microwave and Millimeter-wave Photonics |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | [Invited Talk] Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air |
Sub Title (in English) | |
Keyword(1) | Packaging of LiNbO3 optical device |
Keyword(2) | Passive alignment |
Keyword(3) | LiNbO3-Si bonding |
Keyword(4) | Low-temperature bonding |
Keyword(5) | Au microbump |
Keyword(6) | Hybrid integration |
1st Author's Name | Ryo Takigawa |
1st Author's Affiliation | Kyushu University(Kyushu Univ.) |
Date | 2017-11-09 |
Paper # | MWP2017-46 |
Volume (vol) | vol.117 |
Number (no) | MWP-292 |
Page | pp.pp.7-11(MWP), |
#Pages | 5 |
Date of Issue | 2017-11-02 (MWP) |