Presentation 2017-11-09
[Invited Talk] Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air
Ryo Takigawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) As an alternative to conventional AuSn solder bonding, we have developed low-temperature solid-state bonding method of Au for high-density packaging of optical components. In this presentation, we report passive alignment and mounting of lithium niobate (LiNbO3) optical waveguide chips on Si substrates using surface activated low-temperature bonding with Au microbumps.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Packaging of LiNbO3 optical device / Passive alignment / LiNbO3-Si bonding / Low-temperature bonding / Au microbump / Hybrid integration
Paper # MWP2017-46
Date of Issue 2017-11-02 (MWP)

Conference Information
Committee MWP
Conference Date 2017/11/9(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Kikai-Shinko-Kaikan Bldg.
Topics (in Japanese) (See Japanese page)
Topics (in English) Device, MWP-related topics, etc
Chair Tetsuya Kawanishi(Waseda Univ.)
Vice Chair Naoto Yoshimoto(Chitose Inst. of Science and Tech.)
Secretary Naoto Yoshimoto(NICT)
Assistant Kosuke Nishimura(KDDI) / Kensuke Ikeda(CRIEPI)

Paper Information
Registration To Technical Committee on Microwave and Millimeter-wave Photonics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air
Sub Title (in English)
Keyword(1) Packaging of LiNbO3 optical device
Keyword(2) Passive alignment
Keyword(3) LiNbO3-Si bonding
Keyword(4) Low-temperature bonding
Keyword(5) Au microbump
Keyword(6) Hybrid integration
1st Author's Name Ryo Takigawa
1st Author's Affiliation Kyushu University(Kyushu Univ.)
Date 2017-11-09
Paper # MWP2017-46
Volume (vol) vol.117
Number (no) MWP-292
Page pp.pp.7-11(MWP),
#Pages 5
Date of Issue 2017-11-02 (MWP)