| Presentation | 2017-10-19 Study of Via Hole on MMIC using Nickel Layer Takahiro Tsushima, Masayuki Kimishima, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In MMIC (Microwave Monolithic Integrated Circuit) and PCB (Printed Circuit Board), nickel plating is widely used. However, since nickel is a ferromagnetic material, there is concern about the magnetic influence on circuit components. In PCB, it is reported that conductor loss increases due to the influence of nickel plating as a base of gold plating. In this paper, we confirmed that how the nickel layer affects the characteristics of via holes on MMIC using electromagnetic simulation. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electromagnetic Simulation / Nickel / MMIC |
| Paper # | EMCJ2017-33,MW2017-85,EST2017-48 |
| Date of Issue | 2017-10-12 (EMCJ, MW, EST) |
| Conference Information | |
| Committee | MW / EMCJ / EST / IEE-EMC |
|---|---|
| Conference Date | 2017/10/19(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Yupopo |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Electromagnetic simulation ，EMC, Microwave technologies |
| Chair | Masahiro Muraguchi(TUC) / Osami Wada(Kyoto Univ.) / Hideaki Kimura(NTT) / 山崎 健一(電中研) |
| Vice Chair | Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(NTTdocomo) / Kenichi Tajima(Mitsubishi Electric) / Kensei Oh(Nagoya Inst. of Tech.) / Akimasa Hirata(Nagoya Inst. of Tech.) / Shinichiro Ohnuki(Nihon Univ.) |
| Secretary | Yoshinori Kogami(Tokyo Inst. of Tech.) / Hiroshi Okazaki(HITACHI) / Kenichi Tajima(AIST) / Kensei Oh(Mitsubishi Electric) / Akimasa Hirata(Tohoku Univ.) / Shinichiro Ohnuki(CIST) / (東北学院大) |
| Assistant | Satoshi Ono(Univ. of Electro-Comm.) / Mizuki Motoyoshi(Tohoku Univ.) / Shinichiro Yamamoto(Univ. of Hyogo) / Chie Sasaki(Panasonic) / Shinobu Nagasawa(Mitsubishi Electric) / Takahiro Ito(Nagoya Inst. of Tech.) / Kazuhiro Fujita(Fujitsu) / 井渕 貴章(阪大) |
| Paper Information | |
| Registration To | Technical Committee on Microwaves / Technical Committee on Electromagnetic Compatibility / Technical Committee on Electronics Simulation Technology / Technical Meeting on Electromagnetic Compatibility |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study of Via Hole on MMIC using Nickel Layer |
| Sub Title (in English) | |
| Keyword(1) | Electromagnetic Simulation |
| Keyword(2) | Nickel |
| Keyword(3) | MMIC |
| 1st Author's Name | Takahiro Tsushima |
| 1st Author's Affiliation | Advantest Laboratories Ltd.(AT Lab.) |
| 2nd Author's Name | Masayuki Kimishima |
| 2nd Author's Affiliation | Advantest Laboratories Ltd.(AT Lab.) |
| Date | 2017-10-19 |
| Paper # | EMCJ2017-33,MW2017-85,EST2017-48 |
| Volume (vol) | vol.117 |
| Number (no) | EMCJ-243,MW-244,EST-245 |
| Page | pp.pp.41-44(EMCJ), pp.41-44(MW), pp.41-44(EST), |
| #Pages | 4 |
| Date of Issue | 2017-10-12 (EMCJ, MW, EST) |