Presentation 2017-06-20
Heavily-doped SOI Substrate and Transfer Printing for Fabrication of TMDC FETs
Takamasa Kawanago, Ryo Ikoma, Hiroyuki Takagi, Shunri Oda,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # SDM2017-28
Date of Issue 2017-06-13 (SDM)

Conference Information
Committee SDM
Conference Date 2017/6/20(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Campus Innovation Center Tokyo
Topics (in Japanese) (See Japanese page)
Topics (in English) Material Science and Process Technology for MOS Devices and Memories
Chair Tatsuya Kunikiyo(Renesas)
Vice Chair Takahiro Shinada(Tohoku Univ.)
Secretary Takahiro Shinada(Tohoku Univ.)
Assistant Hiroya Ikeda(Shizuoka Univ.)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Heavily-doped SOI Substrate and Transfer Printing for Fabrication of TMDC FETs
Sub Title (in English)
Keyword(1)
1st Author's Name Takamasa Kawanago
1st Author's Affiliation Tokyo Institute of Technology(Tokyo Inst. of Tech.)
2nd Author's Name Ryo Ikoma
2nd Author's Affiliation Tokyo Institute of Technology(Tokyo Inst. of Tech.)
3rd Author's Name Hiroyuki Takagi
3rd Author's Affiliation Tokyo Institute of Technology(Tokyo Inst. of Tech.)
4th Author's Name Shunri Oda
4th Author's Affiliation Tokyo Institute of Technology(Tokyo Inst. of Tech.)
Date 2017-06-20
Paper # SDM2017-28
Volume (vol) vol.117
Number (no) SDM-101
Page pp.pp.35-38(SDM),
#Pages 4
Date of Issue 2017-06-13 (SDM)