| Presentation | 2017-07-21 A Power Divider of RF Module for High SHF Wide-band Massive MIMO in 5G Hideharu Yoshioka, Yasuo Morimoto, Hiroyuki Aoyama, Takeshi Yuasa, Takeshi Oshima, Naofumi Yoneda, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | For realization of the 5th generation mobile communication system, high SHF wide-band massive MIMO are gaining attention. In this MIMO, a compact RF front end is required, so that a device configuration using a multi-layered substrate capable of high density wiring becomes useful. Therefore, in this front end, most of the main passive circuits are composed of multi-layered substrate. In a power divider which is one of its main circuits formed on a multi-layered substrate, it is effective that application of a Wilkinson type power divider composed of a strip line in a multi-layered substrate and a surface mount type isolation resistor. However, vias are required for inter-layer connection between the output port and the isolation resistance of the divider, so it is deteriorated that the reflection characteristics of output pots and the isolation characteristic between output ports due to the effects of mismatch by vias. In this study, In order to solve the above problem, we have proposed a Wilkinson type power divider consisting of a stripline loaded with two open stubs and a surface mount type isolation resistor. Then, 16 way divider applying this configuration were designed and experimentally verified. As a result, in both the measurement and the analysis result, the distribution characteristics including the loss of the inter-step connecting strip line of the distributor, the internal loss of the divider and the distribution loss showed as good as about -14.3 dB at the center frequency. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Wilkinson divider / Multi-layered substrate / Chip-resistor / 5G |
| Paper # | EMT2017-32,MW2017-57,OPE2017-37,EST2017-34,MWP2017-34 |
| Date of Issue | 2017-07-13 (EMT, MW, OPE, EST, MWP) |
| Conference Information | |
| Committee | MWP / OPE / EMT / MW / EST / IEE-EMT |
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| Conference Date | 2017/7/20(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Obihiro Chamber of Commerce and Industry |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Light wave & Electromagnetic Wave Workshop |
| Chair | Tetsuya Kawanishi(Waseda Univ.) / Kazutoshi Kato(Kyushu Univ.) / Akira Hirose(Univ. of Tokyo) / Masahiro Muraguchi(TUC) / Hideaki Kimura(NTT) / Keiji Goto(National Defense Academy) |
| Vice Chair | Naoto Yoshimoto(Chitose Inst. of Science and Tech.) / Kouki Sato(Furukawa Electric Industries) / Koichi Hirayama(Kitami Inst. of Tech.) / Yoshinori Kogami(Utsunomiya Univ.) / Hiroshi Okazaki(NTTdocomo) / Kenichi Tajima(Mitsubishi Electric) / Akimasa Hirata(Nagoya Inst. of Tech.) / Shinichiro Ohnuki(Nihon Univ.) |
| Secretary | Naoto Yoshimoto(NICT) / Kouki Sato(Chiba Inst. of Tech.) / Koichi Hirayama(NTT) / Yoshinori Kogami(Kanagawa Inst. of Tech.) / Hiroshi Okazaki(Univ. of Hyogo) / Kenichi Tajima(Tokyo Metro. Coll. of Tech) / Akimasa Hirata(Tokyo Inst. of Tech.) / Shinichiro Ohnuki(HITACHI) / (Tohoku Univ.) |
| Assistant | Kosuke Nishimura(KDDI) / Kensuke Ikeda(CRIEPI) / Takuo Tanemura(Univ. of Tokyo) / Tsuyoshi Matsuoka(Kyushu Sangyo Univ.) / Satoshi Ono(Univ. of Electro-Comm.) / Mizuki Motoyoshi(Tohoku Univ.) / Takahiro Ito(Nagoya Inst. of Tech.) / Kazuhiro Fujita(Fujitsu) / Yoshihiro Naka(KUHW) |
| Paper Information | |
| Registration To | Technical Committee on Microwave and Millimeter-wave Photonics / Technical Committee on OptoElectronics / Technical Committee on Electromagnetic Theory / Technical Committee on Microwaves / Technical Committee on Electronics Simulation Technology / Technical Meeting on Electromagnetic Theory |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Power Divider of RF Module for High SHF Wide-band Massive MIMO in 5G |
| Sub Title (in English) | |
| Keyword(1) | Wilkinson divider |
| Keyword(2) | Multi-layered substrate |
| Keyword(3) | Chip-resistor |
| Keyword(4) | 5G |
| 1st Author's Name | Hideharu Yoshioka |
| 1st Author's Affiliation | Mitsubishi Electric Corporation(Mitsubishi Electric) |
| 2nd Author's Name | Yasuo Morimoto |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation(Mitsubishi Electric) |
| 3rd Author's Name | Hiroyuki Aoyama |
| 3rd Author's Affiliation | Mitsubishi Electric Corporation(Mitsubishi Electric) |
| 4th Author's Name | Takeshi Yuasa |
| 4th Author's Affiliation | Mitsubishi Electric Corporation(Mitsubishi Electric) |
| 5th Author's Name | Takeshi Oshima |
| 5th Author's Affiliation | Mitsubishi Electric Corporation(Mitsubishi Electric) |
| 6th Author's Name | Naofumi Yoneda |
| 6th Author's Affiliation | Mitsubishi Electric Corporation(Mitsubishi Electric) |
| Date | 2017-07-21 |
| Paper # | EMT2017-32,MW2017-57,OPE2017-37,EST2017-34,MWP2017-34 |
| Volume (vol) | vol.117 |
| Number (no) | EMT-139,MW-140,OPE-141,EST-142,MWP-143 |
| Page | pp.pp.139-143(EMT), pp.139-143(MW), pp.139-143(OPE), pp.139-143(EST), pp.139-143(MWP), |
| #Pages | 5 |
| Date of Issue | 2017-07-13 (EMT, MW, OPE, EST, MWP) |