Presentation 2017-06-19
Placement Algorithm for Mixed-Grained Reconfigurable Architecture with Dedicated Carry Chain
Koki Honda, Takashi Imagawa, Hiroyuki Ochi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This paper proposes a placement algorithm using analytical placement (AP) and low-temperature simulated annealing (SA) for mixed-grained reconfigurable architecture (MGRA) with dedicated carry chains. The target MGRAs are assumed to have fine-grained blocks with dedicated carry chains to implement high-speed adders/subtracters and coarse-grained blocks to implement complicated arithmetic operations. Although this architecture is expected to enhance the performance of the implemented circuit, placement using simple pair-swap-based SA often converges to a local optimum. The proposed algorithm uses AP to determine an initial placement for SA. The AP explores an appropriate placement of coarse-grained blocks and adders/subtracters consisting of fine-grained blocks and dedicated carry chains. On the other hand, SA is mainly used to determine optimal placement of the remaining fine-grained blocks. The evaluations show that the proposed algorithm reduces the placement cost, critical path delay, and runtime by 18.4%, 6.0%, and 67.6% on average, respectively, over the Versatile Place and Route (VPR). The benchmark includes circuits consisting of only fine-grained logic. Hence, the proposed algorithm is expected to improve the placement quality for a wide range of application circuits.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) analytical placement / low-temperature simulated annealing / initial placement / initial temperature
Paper # CAS2017-4,VLD2017-7,SIP2017-28,MSS2017-4
Date of Issue 2017-06-12 (CAS, VLD, SIP, MSS)

Conference Information
Committee SIP / CAS / MSS / VLD
Conference Date 2017/6/19(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Niigata University, Ikarashi Campus
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Masahiro Okuda(Univ. of Kitakyushu) / Mitsuru Hiraki(Renesas) / Morikazu Nakamura(Univ. of Ryukyus) / Hiroyuki Ochi(Ritsumeikan Univ.)
Vice Chair Shogo Muramatsu(Niigata Univ.) / Naoyuki Aikawa(TUS) / Hideaki Okazaki(Shonan Inst. of Tech.) / Shigemasa Takai(Osaka Univ.) / Noriyuki Minegishi(Mitsubishi Electric)
Secretary Shogo Muramatsu(Chiba Inst. of Tech.) / Naoyuki Aikawa(Takushoku Univ.) / Hideaki Okazaki(Renesas) / Shigemasa Takai(Shonan Inst. of Tech.) / Noriyuki Minegishi(Toshiba)
Assistant Masayoshi Nakamoto(Hiroshima Univ.ひろ) / Yohei Nakamura(Hitachi) / Hideki Kinjo(Okinawa Univ.)

Paper Information
Registration To Technical Committee on Signal Processing / Technical Committee on Circuits and Systems / Technical Committee on Mathematical Systems Science and its applications / Technical Committee on VLSI Design Technologies
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Placement Algorithm for Mixed-Grained Reconfigurable Architecture with Dedicated Carry Chain
Sub Title (in English)
Keyword(1) analytical placement
Keyword(2) low-temperature simulated annealing
Keyword(3) initial placement
Keyword(4) initial temperature
1st Author's Name Koki Honda
1st Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
2nd Author's Name Takashi Imagawa
2nd Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
3rd Author's Name Hiroyuki Ochi
3rd Author's Affiliation Ritsumeikan University(Ritsumeikan Univ.)
Date 2017-06-19
Paper # CAS2017-4,VLD2017-7,SIP2017-28,MSS2017-4
Volume (vol) vol.117
Number (no) CAS-96,VLD-97,SIP-98,MSS-99
Page pp.pp.19-24(CAS), pp.19-24(VLD), pp.19-24(SIP), pp.19-24(MSS),
#Pages 6
Date of Issue 2017-06-12 (CAS, VLD, SIP, MSS)