| 講演名 | 2017-05-19 [Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics En-Xiao Liu(A*STAR IHPC), Siping Gao(A*STAR IHPC), Hui Min Lee(A*STAR IHPC), |
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| 抄録(和) | Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design. This talk will first present a survey of 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D- DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results. |
| 抄録(英) | Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design. This talk will first present a survey of 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D- DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results. |
| キーワード(和) | modeling and simulation / signal integrity / power integrity / modal decomposition / 2.5D method / DGTD |
| キーワード(英) | modeling and simulation / signal integrity / power integrity / modal decomposition / 2.5D method / DGTD |
| 資料番号 | EMCJ2017-19 |
| 発行日 | 2017-05-11 (EMCJ) |
| 研究会情報 | |
| 研究会 | EMCJ / IEE-EMC / IEE-MAG |
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| 開催期間 | 2017/5/18(から2日開催) |
| 開催地（和） | 南洋理工大学 |
| 開催地（英） | Nanyang Technological University |
| テーマ（和） | EMC Joint Workshop, 2017, Singapore |
| テーマ（英） | EMC Joint Workshop, 2017, Singapore |
| 委員長氏名（和） | 曽根 秀昭(東北大) / 川又 憲(東北学院大) / 山口 正洋(東北大) |
| 委員長氏名（英） | Hideaki Sone(Tohoku Univ.) / Ken Kawamata(Tohoku-gakuin Univ.) / Masahiro Yamaguchi(Tohoku Univ.) |
| 副委員長氏名（和） | 和田 修己(京大) |
| 副委員長氏名（英） | Osami Wada(Kyoto Univ.) |
| 幹事氏名（和） | 森岡 健浩(産総研) / 大坂 英樹(日立オートモティブシステムズ) / 牛尾 知雄(阪大) / 関口 秀紀(海技研) / 小原 学(明治大) |
| 幹事氏名（英） | Takehiro Morioka(AIST) / Hideki Osaka(Hitachi Automotive Systems) / Tomoo Ushio(Osaka Univ.) / Hidenori Sekiguchi(NMRI) / Gaku Obara(Meji Univ.) |
| 幹事補佐氏名（和） | 萓野 良樹(電通大) / 勝部 勇作(日立オートモティブシステムズ) / 佐々木 智江(パナソニック) / 井渕 貴章(阪大) / 山田 啓壽(東芝) |
| 幹事補佐氏名（英） | Yoshiki Kayano(Univ. of Electro-Comm.) / Yusaku Katsube(Hitachi) / Chie Sasaki(Panasonic) / Takaaki Ibuchi(Osaka Univ.) / Keiju Yamada(Toshiba Co.) |
| 講演論文情報詳細 | |
| 申込み研究会 | Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility / Technical Meeting on Magnetics |
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| 本文の言語 | ENG |
| タイトル（和） | |
| サブタイトル（和） | |
| タイトル（英） | [Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics |
| サブタイトル（和） | |
| キーワード(1)（和/英） | modeling and simulation / modeling and simulation |
| キーワード(2)（和/英） | signal integrity / signal integrity |
| キーワード(3)（和/英） | power integrity / power integrity |
| キーワード(4)（和/英） | modal decomposition / modal decomposition |
| キーワード(5)（和/英） | 2.5D method / 2.5D method |
| キーワード(6)（和/英） | DGTD / DGTD |
| 第 1 著者 氏名（和/英） | En-Xiao Liu / En-Xiao Liu |
| 第 1 著者 所属（和/英） | A*STAR Institute of High Performance Computing(略称：A*STAR IHPC) A*STAR Institute of High Performance Computing(略称：A*STAR IHPC) |
| 第 2 著者 氏名（和/英） | Siping Gao / Siping Gao |
| 第 2 著者 所属（和/英） | A*STAR Institute of High Performance Computing(略称：A*STAR IHPC) A*STAR Institute of High Performance Computing(略称：A*STAR IHPC) |
| 第 3 著者 氏名（和/英） | Hui Min Lee / Hui Min Lee |
| 第 3 著者 所属（和/英） | A*STAR Institute of High Performance Computing(略称：A*STAR IHPC) A*STAR Institute of High Performance Computing(略称：A*STAR IHPC) |
| 発表年月日 | 2017-05-19 |
| 資料番号 | EMCJ2017-19 |
| 巻番号（vol） | vol.117 |
| 号番号（no） | EMCJ-32 |
| ページ範囲 | pp.67-67(EMCJ), |
| ページ数 | 1 |
| 発行日 | 2017-05-11 (EMCJ) |