| Presentation | 2017-05-19 [Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics En-Xiao Liu, Siping Gao, Hui Min Lee, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design. This talk will first present a survey of 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D- DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | modeling and simulation / signal integrity / power integrity / modal decomposition / 2.5D method / DGTD |
| Paper # | EMCJ2017-19 |
| Date of Issue | 2017-05-11 (EMCJ) |
| Conference Information | |
| Committee | EMCJ / IEE-EMC / IEE-MAG |
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| Conference Date | 2017/5/18(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Nanyang Technological University |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | EMC Joint Workshop, 2017, Singapore |
| Chair | Hideaki Sone(Tohoku Univ.) / Ken Kawamata(Tohoku-gakuin Univ.) / Masahiro Yamaguchi(Tohoku Univ.) |
| Vice Chair | Osami Wada(Kyoto Univ.) |
| Secretary | Osami Wada(AIST) / (Hitachi Automotive Systems) / (Osaka Univ.) |
| Assistant | Yoshiki Kayano(Univ. of Electro-Comm.) / Yusaku Katsube(Hitachi) / Chie Sasaki(Panasonic) / Takaaki Ibuchi(Osaka Univ.) / Keiju Yamada(Toshiba Co.) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Compatibility / Technical Meeting on Electromagnetic Compatibility / Technical Meeting on Magnetics |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics |
| Sub Title (in English) | |
| Keyword(1) | modeling and simulation |
| Keyword(2) | signal integrity |
| Keyword(3) | power integrity |
| Keyword(4) | modal decomposition |
| Keyword(5) | 2.5D method |
| Keyword(6) | DGTD |
| 1st Author's Name | En-Xiao Liu |
| 1st Author's Affiliation | A*STAR Institute of High Performance Computing(A*STAR IHPC) |
| 2nd Author's Name | Siping Gao |
| 2nd Author's Affiliation | A*STAR Institute of High Performance Computing(A*STAR IHPC) |
| 3rd Author's Name | Hui Min Lee |
| 3rd Author's Affiliation | A*STAR Institute of High Performance Computing(A*STAR IHPC) |
| Date | 2017-05-19 |
| Paper # | EMCJ2017-19 |
| Volume (vol) | vol.117 |
| Number (no) | EMCJ-32 |
| Page | pp.pp.67-67(EMCJ), |
| #Pages | 1 |
| Date of Issue | 2017-05-11 (EMCJ) |