Presentation 2017-05-25
Realization of high frequency LLC resonant converter with GaN device
Takehiro Shimizu, Yoshiaki Matsuda, Yousuke Inoue,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Recently, the miniaturization and thinning of equipment has advanced, demand for miniaturization of the power supply to be mounted has become stronger. In order to miniaturize the power supply, the switching frequency should be increased to the high frequency, but depending on the characteristics of the parts used so far, making it difficult to increase the frequency. However, the diffusion of SiC and GaN called next-generation semiconductor devices and the diffusion of circuit topology with the evolution, the possibility of high frequency (MHz) switching has come to be seen. This paper shows the contents of considering various possible problems concerning high frequency power supply. Also, the evaluation results of the prototype power supply based on the contents of consideration are reported.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) LLC resonant converter / high frequency / miniaturization / GaN device
Paper # EE2017-2
Date of Issue 2017-05-18 (EE)

Conference Information
Committee EE / IEE-HCA
Conference Date 2017/5/25(2days)
Place (in Japanese) (See Japanese page)
Place (in English) The Kikai Shinko Kaikan building
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Fujio Kurokawa(Nagasaki Institute of Applied Science)
Vice Chair Masatoshi Nakahara(Sojo Univ.)
Secretary Masatoshi Nakahara(Fukuoka Univ.) / (NTT)
Assistant Hidenori Maruta(Nagasaki Univ.) / Takashi Matsushita(NTT-F)

Paper Information
Registration To Technical Committee on Energy Engineering in Electronics and Communications / Technical Meeting on Home and Consumer Appliances
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Realization of high frequency LLC resonant converter with GaN device
Sub Title (in English)
Keyword(1) LLC resonant converter
Keyword(2) high frequency
Keyword(3) miniaturization
Keyword(4) GaN device
1st Author's Name Takehiro Shimizu
1st Author's Affiliation Shindengen Electric Manufacturing Co., Ltd.(Shindengen)
2nd Author's Name Yoshiaki Matsuda
2nd Author's Affiliation STES Co., Ltd.(STES)
3rd Author's Name Yousuke Inoue
3rd Author's Affiliation Shindengen Kumamoto Techno-Research Co., Ltd.(Shindengen Kumamoto)
Date 2017-05-25
Paper # EE2017-2
Volume (vol) vol.117
Number (no) EE-53
Page pp.pp.7-11(EE),
#Pages 5
Date of Issue 2017-05-18 (EE)