| Presentation | 2017-02-21 Design for Evaluation of TSV based Interconnections in 3D-SIC Shuichi Kameyama, Senling Wang, Hiroshi Takahashi, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper introduces a concept of Design for Evaluation (DFE) that is a design method to embed circuits for quality evaluation of products into LSIs and/or boards. As a specific example of the DFE, we introduce a precise analog measuring circuit and technic for the TSV based interconnection resistance of 3D stacked IC (3D-SIC). In addition, we report the evaluated results for the feasibility of the method based on an experiment and the placement and routing design. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Design for Evaluation / DFE / 3D-SIC / Interconnect / 1149.1 / Analog Boundary Scan |
| Paper # | DC2016-83 |
| Date of Issue | 2017-02-14 (DC) |
| Conference Information | |
| Committee | DC |
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| Conference Date | 2017/2/21(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | VLSI Design and Test, etc |
| Chair | Michiko Inoue(NAIST) |
| Vice Chair | Satoshi Fukumoto(Tokyo Metropolitan Univ.) |
| Secretary | Satoshi Fukumoto(Kyoto Sangyo Univ.) |
| Assistant | |
| Paper Information | |
| Registration To | Technical Committee on Dependable Computing |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Design for Evaluation of TSV based Interconnections in 3D-SIC |
| Sub Title (in English) | Interconnection Resistance Evaluation with Analog Boundary Scan |
| Keyword(1) | Design for Evaluation |
| Keyword(2) | DFE |
| Keyword(3) | 3D-SIC |
| Keyword(4) | Interconnect |
| Keyword(5) | 1149.1 |
| Keyword(6) | Analog Boundary Scan |
| 1st Author's Name | Shuichi Kameyama |
| 1st Author's Affiliation | Ehime University/Fujitsu Limited(Ehime Univ./Fujitsu) |
| 2nd Author's Name | Senling Wang |
| 2nd Author's Affiliation | Ehime University(Ehime Univ.) |
| 3rd Author's Name | Hiroshi Takahashi |
| 3rd Author's Affiliation | Ehime University(Ehime Univ.) |
| Date | 2017-02-21 |
| Paper # | DC2016-83 |
| Volume (vol) | vol.116 |
| Number (no) | DC-466 |
| Page | pp.pp.53-58(DC), |
| #Pages | 6 |
| Date of Issue | 2017-02-14 (DC) |