| Presentation | 2017-02-17 Report on thermal simulation technique to analyze effect of contact bounce arc. Kazua Murakami, Takeshi Nishida, Tetsuo Shinkai, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We report a thermal analysis method to quantify the melting phenomenon of the contact which causes the contact welding phenomenon of the relay. Melting phenomenon of the contact occurs due to energy being supplied to the contact by the motion bounce arc. At this time, it was found that when the energy of the arc is continued to be given at one point, the analysis result becomes a melting state different from the actual measurement. In this report, the results of thermal analysis are compared with the actual measurement result of the contact melting area by the same arc energy, and the way of giving the arc energy to reproduce the actual measurement is verified. As a result, it was found that the arc energy does not continue to be given at one point, but arc melts the contact while moving on the contact surface. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Contact / Thermal / Melting Contact / Simulation |
| Paper # | R2016-71,EMD2016-98 |
| Date of Issue | 2017-02-10 (R, EMD) |
| Conference Information | |
| Committee | EMD / R |
|---|---|
| Conference Date | 2017/2/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Omuron Kusatsu Factory |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Yoshiteru Abe(NTT) / Hiroyasu Mawatari(NTT) |
| Vice Chair | / Tetsushi Yuge(National Defense Academy) |
| Secretary | (Sumitomo Denso) / Tetsushi Yuge(Fujielectric) |
| Assistant | Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Electromechanical Devices / Technical Committee on Reliability |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Report on thermal simulation technique to analyze effect of contact bounce arc. |
| Sub Title (in English) | |
| Keyword(1) | Contact |
| Keyword(2) | Thermal |
| Keyword(3) | Melting Contact |
| Keyword(4) | Simulation |
| 1st Author's Name | Kazua Murakami |
| 1st Author's Affiliation | Omron Corporation(Omron) |
| 2nd Author's Name | Takeshi Nishida |
| 2nd Author's Affiliation | Omron Corporation(Omron) |
| 3rd Author's Name | Tetsuo Shinkai |
| 3rd Author's Affiliation | Omron Relay And Device Corporation(OER) |
| Date | 2017-02-17 |
| Paper # | R2016-71,EMD2016-98 |
| Volume (vol) | vol.116 |
| Number (no) | R-458,EMD-459 |
| Page | pp.pp.65-70(R), pp.65-70(EMD), |
| #Pages | 6 |
| Date of Issue | 2017-02-10 (R, EMD) |