| Presentation | 2017-02-17 Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices Osmau Ohtani, Tomohiro Fukuhara, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The adhesives for the mechanical device such as Relay or Switch are required the tracking resistance, the contact reliability and the sealing property in addition to the adhesiveness. Generally, One-part epoxy resin is used as fulfill the above mentioned functions and productivity. It consists of liquid epoxy monomer, solid curing agent, and inorganic filler. As the functions are performed by the chemical reaction between liquid epoxy monomer and solid curing, the improvement of these two molecular structures was lead to a performance of the adhesives. On the other hand, the influence of the filler had not investigated without improving the mechanical property and the thermal characteristic. In this report, as focusing functionalization of the filler, we revealed that the class and particle diameter of the filler is influenced on the tracking resistance, the contact reliability, and sealing property. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Electromechanical Device / Adhesion Reliabity / One-part epoxy resin |
| Paper # | R2016-68,EMD2016-95 |
| Date of Issue | 2017-02-10 (R, EMD) |
| Conference Information | |
| Committee | EMD / R |
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| Conference Date | 2017/2/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Omuron Kusatsu Factory |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | Yoshiteru Abe(NTT) / Hiroyasu Mawatari(NTT) |
| Vice Chair | / Tetsushi Yuge(National Defense Academy) |
| Secretary | (Sumitomo Denso) / Tetsushi Yuge(Fujielectric) |
| Assistant | Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Electromechanical Devices / Technical Committee on Reliability |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices |
| Sub Title (in English) | |
| Keyword(1) | Electromechanical Device |
| Keyword(2) | Adhesion Reliabity |
| Keyword(3) | One-part epoxy resin |
| 1st Author's Name | Osmau Ohtani |
| 1st Author's Affiliation | Omron Corporation(Omron Corp.) |
| 2nd Author's Name | Tomohiro Fukuhara |
| 2nd Author's Affiliation | Omron Corporation(Omron Corp.) |
| Date | 2017-02-17 |
| Paper # | R2016-68,EMD2016-95 |
| Volume (vol) | vol.116 |
| Number (no) | R-458,EMD-459 |
| Page | pp.pp.49-52(R), pp.49-52(EMD), |
| #Pages | 4 |
| Date of Issue | 2017-02-10 (R, EMD) |