Presentation 2017-02-21
Thermal Imaging for Crack in Shallow Layer of Solid Material by Using Very High-intensity Aerial Ultrasonic Waves
Ayumu Osumi, Hirotaka Sato, Youichi Ito,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # US2016-125
Date of Issue 2017-02-14 (US)

Conference Information
Committee US
Conference Date 2017/2/21(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
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Topics (in English)
Chair Nobuyuki Endo(Kanagawa Univ.)
Vice Chair Yoichi Itoh(Nihon Univ.) / Minoru Kurosawa(Tokyo Inst. of Tech.)
Secretary Yoichi Itoh(Univ. of Electro-Comm.) / Minoru Kurosawa(Univ. of Toyama)
Assistant Takeshi Morita(Univ. of Tokyo)

Paper Information
Registration To Technical Committee on Ultrasonics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Thermal Imaging for Crack in Shallow Layer of Solid Material by Using Very High-intensity Aerial Ultrasonic Waves
Sub Title (in English)
Keyword(1)
1st Author's Name Ayumu Osumi
1st Author's Affiliation Nihon University(Nihon Univ.)
2nd Author's Name Hirotaka Sato
2nd Author's Affiliation Nihon University(Nihon Univ.)
3rd Author's Name Youichi Ito
3rd Author's Affiliation Nihon University(Nihon Univ.)
Date 2017-02-21
Paper # US2016-125
Volume (vol) vol.116
Number (no) US-465
Page pp.pp.25-29(US),
#Pages 5
Date of Issue 2017-02-14 (US)