Presentation 2017-02-17
Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy
Shigeru Sawada, Song-zhu Kure-chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro, Yasushi Saitoh,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This study is aimed at clarifying the mechanism of wear process for Ag plating with different hardness. The samples of Ag plating on Cu alloys were prepared as coupon and embossment specimens, which simulated terminal contacts. During the sliding test, the contact resistance and the friction coefficient versus sliding distance were measured. The surface observation, surface roughness and worn volume of the Ag films after wear tests were investigated. As results, the hard Ag plating film (120 Hv) exhibited higher contact resistance comparing to the soft Ag plating film (80 Hv). The soft Ag film delivered a larger wear scar on embossment and wider wear trace on coupon specimens compared to the hard one. The overall worn volume of hard Ag film was less than that of soft Ag film, which can be attributed to the fine crystalline structure on hard Ag. Moreover, the observation of tribofilms formed on the Ag films after wear tests suggested that a mixed-type of adhesive and abrasive wears occurred for both of soft and hard Ag films. Furthermore, the hard Ag plating exhibited longer stable region of friction coefficient than the soft one in a linear oscillating fretting test, indicating an enhanced fretting corrosion resistance.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Connector / silver plating / friction coefficient / contact resistance / sliding friction
Paper # R2016-63,EMD2016-90
Date of Issue 2017-02-10 (R, EMD)

Conference Information
Committee EMD / R
Conference Date 2017/2/17(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Omuron Kusatsu Factory
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Yoshiteru Abe(NTT) / Hiroyasu Mawatari(NTT)
Vice Chair / Tetsushi Yuge(National Defense Academy)
Secretary (Sumitomo Denso) / Tetsushi Yuge(Fujielectric)
Assistant Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.)

Paper Information
Registration To Technical Committee on Electromechanical Devices / Technical Committee on Reliability
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy
Sub Title (in English)
Keyword(1) Connector
Keyword(2) silver plating
Keyword(3) friction coefficient
Keyword(4) contact resistance
Keyword(5) sliding friction
Keyword(6)
Keyword(7)
1st Author's Name Shigeru Sawada
1st Author's Affiliation Sumitomo Electric Ltd.,(SEI)
2nd Author's Name Song-zhu Kure-chu
2nd Author's Affiliation Iwate University(Iwate Uni.)
3rd Author's Name Rie Nakagawa
3rd Author's Affiliation Iwate University(Iwate Uni.)
4th Author's Name Toru Ogasawara
4th Author's Affiliation Iwate University(Iwate Uni.)
5th Author's Name Hitoshi Yashiro
5th Author's Affiliation Iwate University(Iwate Uni.)
6th Author's Name Yasushi Saitoh
6th Author's Affiliation AutoNetworks Technologies, Ltd.(AN-Tech)
Date 2017-02-17
Paper # R2016-63,EMD2016-90
Volume (vol) vol.116
Number (no) R-458,EMD-459
Page pp.pp.19-24(R), pp.19-24(EMD),
#Pages 6
Date of Issue 2017-02-10 (R, EMD)