| Presentation | 2017-02-06 [Invited Talk] Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure Masako Kodera, Hiroyuki Yano, Naoto Miyashita, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We evaluated the impact of process damage caused by dry or sputtering on chemical mechanical planarization (CMP) with Cu/low-k structures. We revealed that dry process drastically decreased C-H/C-C bonding in low-k films, and CMP mechanism of the low-k film was completely different between with and without dry processing. Although CMP slurry for low-k films usually contains surfactant to promote CMP removal rate of hydrophobic low-k surface, the C-H/C-C decrease of the low-k film significantly changes the absorption model of the surfactant. Moreover, during fabrication of Cu wiring, carbon missing inhomogeneously occurs within the low-k film. Thus, slurry design considering C-H/C-C missing in low-k films is a clue for successful fabrication. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | low-k / Cu / CMP / Dry etch / damage / surfactant |
| Paper # | SDM2016-139 |
| Date of Issue | 2017-01-30 (SDM) |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2017/2/6(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tokyo Univ. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Interconnects, Package and related materials |
| Chair | Tatsuya Kunikiyo(Renesas) |
| Vice Chair | Takahiro Shinada(Tohoku Univ.) |
| Secretary | Takahiro Shinada(Tohoku Univ.) |
| Assistant | Hiroya Ikeda(Shizuoka Univ.) |
| Paper Information | |
| Registration To | Technical Committee on Silicon Device and Materials |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | [Invited Talk] Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure |
| Sub Title (in English) | |
| Keyword(1) | low-k |
| Keyword(2) | Cu |
| Keyword(3) | CMP |
| Keyword(4) | Dry etch |
| Keyword(5) | damage |
| Keyword(6) | surfactant |
| 1st Author's Name | Masako Kodera |
| 1st Author's Affiliation | Toshiba Corp.(Toshiba) |
| 2nd Author's Name | Hiroyuki Yano |
| 2nd Author's Affiliation | Toshiba Corp.(Toshiba) |
| 3rd Author's Name | Naoto Miyashita |
| 3rd Author's Affiliation | Toshiba Corp.(Toshiba) |
| Date | 2017-02-06 |
| Paper # | SDM2016-139 |
| Volume (vol) | vol.116 |
| Number (no) | SDM-450 |
| Page | pp.pp.1-4(SDM), |
| #Pages | 4 |
| Date of Issue | 2017-01-30 (SDM) |