Presentation 2016-11-17
A Study on Electro Chemical Migration Test for Printed Circuit Board
Sadanori Ito,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The electro chemical migration which shorts the electric circuit occurs under the various use condition such as High Temperature - High Humidity/ Temperature-Humidity Cycle/ Dew condensation Cycle / High Temperature. So, not the unique standard test method but the test method against the suitable purpose is needed. Considering the occurred mechanism via the various electro chemical migration examples, we study the necessary test method and the evaluation method for the soldering printed circuit board
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electro Chemical Migration / Temperature-Humidity Cycle test / Dew condensation Cycle test
Paper # R2016-52
Date of Issue 2016-11-10 (R)

Conference Information
Committee R
Conference Date 2016/11/17(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Osaka Central Electric Club Bldg.
Topics (in Japanese) (See Japanese page)
Topics (in English) Reliability for semiconductors and electronics devices, Overall reliability engineering (co-organized by Reliability Engineering Association of Japan Kansai Branch)
Chair Hiroyasu Mawatari(NTT)
Vice Chair Tetsushi Yuge(National Defense Academy)
Secretary Tetsushi Yuge(Fujitsu)
Assistant Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.)

Paper Information
Registration To Technical Committee on Reliability
Language JPN-ONLY
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study on Electro Chemical Migration Test for Printed Circuit Board
Sub Title (in English)
Keyword(1) Electro Chemical Migration
Keyword(2) Temperature-Humidity Cycle test
Keyword(3) Dew condensation Cycle test
1st Author's Name Sadanori Ito
1st Author's Affiliation Itoken Office(Itoken)
Date 2016-11-17
Paper # R2016-52
Volume (vol) vol.116
Number (no) R-301
Page pp.pp.19-22(R),
#Pages 4
Date of Issue 2016-11-10 (R)