Presentation 2016-11-28
Design for 3-Demensional Sound Processor using a High-Level Synthesis
Saya Ohira, Naoki Tsuchiya, Tetsuya Matsumura,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) High quality sound systems are penetrated into our lifestyle in various fields. In recent years, Minimized audio spot generation function has been studied that applies generation and this sound field using super-directional acoustic function by parametric loudspeaker. In this paper, we report 3-dimensional sound processor IP which combines both a 3-dimensonal sound processing function and super-directional processing function. This 3-dimensonal sound processing IP can configure plural 3-dimensonal sound processing units that achieve Head Related Transfer Function (HTRF) and super-directional processing units, thus this result in realization of high flexibility of high quality sound processing system. This IP design makes audio systems that realize realistic audio spot low cost, small size and low power. IP design has been realized by the reconfigurable design environment that can automatically generate a circuit by setting the main parameters using a High-Level Synthesis tool. This 3-dimensional sound processor IP is implemented with an FPGA for verification purposes.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Minimum region audio spot / Super-directional audio / 3-dimensional sound / High-Level Synthesis
Paper # RECONF2016-40
Date of Issue 2016-11-21 (RECONF)

Conference Information
Committee VLD / DC / CPSY / RECONF / CPM / ICD / IE
Conference Date 2016/11/28(3days)
Place (in Japanese) (See Japanese page)
Place (in English) Ritsumeikan University, Osaka Ibaraki Campus
Topics (in Japanese) (See Japanese page)
Topics (in English) Design Gaia 2016 -New Field of VLSI Design-
Chair Takashi Takenana(NEC) / Michiko Inoue(NAIST) / Yasuhiko Nakashima(NAIST) / Minoru Watanabe(Shizuoka Univ.) / Satoru Noge(Numazu National College of Tech.) / Minoru Fujishima(Hiroshima Univ.) / Seishi Takamura(NTT)
Vice Chair Hiroyuki Ochi(Ritsumeikan Univ.) / Satoshi Fukumoto(Tokyo Metropolitan Univ.) / Koji Nakano(Hiroshima Univ.) / Hidetsugu Irie(Univ. of Tokyo) / Masato Motomura(Hokkaido Univ.) / Yuichiro Shibata(Nagasaki Univ.) / Fumihiko Hirose(Yamagata Univ.) / Hideto Hidaka(Renesas) / Takayuki Hamamoto(Tokyo Univ. of Science) / Atsuro Ichigaya(NHK)
Secretary Hiroyuki Ochi(Fujitsu Labs.) / Satoshi Fukumoto(Hiroshima City Univ.) / Koji Nakano(Kyoto Sangyo Univ.) / Hidetsugu Irie(Tokyo Inst. of Tech.) / Masato Motomura(Fujitsu Labs.) / Yuichiro Shibata(NII) / Fumihiko Hirose(Univ. of Tsukuba) / Hideto Hidaka(Hiroshima City Univ.) / Takayuki Hamamoto(NTT) / Atsuro Ichigaya(Nihon Univ.)
Assistant Parizy Matthieu(Fujitsu Labs.) / / Takeshi Ohkawa(Utsunomiya Univ.) / Shinya Takameda(NAIST) / Takefumi Miyoshi(e-trees.Japan) / Yuuki Kobayashi(NEC) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Takashi Hashimoto(Panasonic) / Masanori Natsui(Tohoku Univ.) / Hiroyuki Ito(Tokyo Inst. of Tech.) / Pham Konkuha(Univ. of Electro-Comm.) / Kei Kawamura(KDDI R&D Labs.) / Keita Takahashi(Nagoya Univ.)

Paper Information
Registration To Technical Committee on VLSI Design Technologies / Technical Committee on Dependable Computing / Technical Committee on Computer Systems / Technical Committee on Reconfigurable Systems / Technical Committee on Component Parts and Materials / Technical Committee on Integrated Circuits and Devices / Technical Committee on Image Engineering
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Design for 3-Demensional Sound Processor using a High-Level Synthesis
Sub Title (in English)
Keyword(1) Minimum region audio spot
Keyword(2) Super-directional audio
Keyword(3) 3-dimensional sound
Keyword(4) High-Level Synthesis
1st Author's Name Saya Ohira
1st Author's Affiliation Nihon University(Nihon Univ.)
2nd Author's Name Naoki Tsuchiya
2nd Author's Affiliation Nihon University(Nihon Univ.)
3rd Author's Name Tetsuya Matsumura
3rd Author's Affiliation Nihon University(Nihon Univ.)
Date 2016-11-28
Paper # RECONF2016-40
Volume (vol) vol.116
Number (no) RECONF-332
Page pp.pp.1-6(RECONF),
#Pages 6
Date of Issue 2016-11-21 (RECONF)