Presentation | 2016-11-03 Effect of hardness on wear and abrasion resistance of Silver plating on copper alloy Shigeru Sawada, Song-zhu Kure-chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro, Yasushi Saitoh, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This study is aimed at clarifying the mechanism of wear process for Ag plating. The samples of different hardness Ag plating on copper alloys were prepared as coupon and embossment specimens, which simulated terminal contacts. During the sliding test, the contact resistance and the friction coefficient versus sliding distance are measured. The surface observation, surface roughness and worn volume of the Ag films after wear tests were investigated. As results, the hard Ag plating film (120 Hv) exhibited higher contact resistance comparing to the soft Ag plating film (80 Hv). The soft Ag film delivered a larger wear scar on embossment and wider wear trace on coupon specimens compared to the soft one. The overall worn volume of hard Ag film was less than that of soft Ag film, which can be attributed to the fine crystalline structure on hard Ag. Moreover, the observation of tribofilms formed on the Ag films after wear tests suggested that a mixed-type of adhesive and abrasive wears occurred for both of soft and hard Ag films. Furthermore, the fretting corrosion resistance of Ag plating samples with different hardness was also investigated. As results, the wear resistance of hard Ag film was stronger than that of soft Ag film. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | connectorsilver platingfriction coefficientcontact resistancesliding friction |
Paper # | EMD2016-57 |
Date of Issue | 2016-10-27 (EMD) |
Conference Information | |
Committee | EMD |
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Conference Date | 2016/11/3(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | Awaji Yumebutai International Conference Center |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | International Session IS-EMD2016 |
Chair | Yoshiteru Abe(NTT) |
Vice Chair | |
Secretary | (Sumitomo Denso) |
Assistant | Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) |
Paper Information | |
Registration To | Technical Committee on Electromechanical Devices |
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Language | ENG |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Effect of hardness on wear and abrasion resistance of Silver plating on copper alloy |
Sub Title (in English) | |
Keyword(1) | connectorsilver platingfriction coefficientcontact resistancesliding friction |
1st Author's Name | Shigeru Sawada |
1st Author's Affiliation | AutoNetworks Technologies, Ltd.(AN-Tech) |
2nd Author's Name | Song-zhu Kure-chu |
2nd Author's Affiliation | Iwate University(Iwate Uni.) |
3rd Author's Name | Rie Nakagawa |
3rd Author's Affiliation | Iwate University(Iwate Uni.) |
4th Author's Name | Toru Ogasawara |
4th Author's Affiliation | Iwate University(Iwate Uni.) |
5th Author's Name | Hitoshi Yashiro |
5th Author's Affiliation | Iwate University(Iwate Uni.) |
6th Author's Name | Yasushi Saitoh |
6th Author's Affiliation | AutoNetworks Technologies, Ltd.(AN-Tech) |
Date | 2016-11-03 |
Paper # | EMD2016-57 |
Volume (vol) | vol.116 |
Number (no) | EMD-283 |
Page | pp.pp.41-46(EMD), |
#Pages | 6 |
Date of Issue | 2016-10-27 (EMD) |