Presentation 2016-11-03
Effect of hardness on wear and abrasion resistance of Silver plating on copper alloy
Shigeru Sawada, Song-zhu Kure-chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro, Yasushi Saitoh,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This study is aimed at clarifying the mechanism of wear process for Ag plating. The samples of different hardness Ag plating on copper alloys were prepared as coupon and embossment specimens, which simulated terminal contacts. During the sliding test, the contact resistance and the friction coefficient versus sliding distance are measured. The surface observation, surface roughness and worn volume of the Ag films after wear tests were investigated. As results, the hard Ag plating film (120 Hv) exhibited higher contact resistance comparing to the soft Ag plating film (80 Hv). The soft Ag film delivered a larger wear scar on embossment and wider wear trace on coupon specimens compared to the soft one. The overall worn volume of hard Ag film was less than that of soft Ag film, which can be attributed to the fine crystalline structure on hard Ag. Moreover, the observation of tribofilms formed on the Ag films after wear tests suggested that a mixed-type of adhesive and abrasive wears occurred for both of soft and hard Ag films. Furthermore, the fretting corrosion resistance of Ag plating samples with different hardness was also investigated. As results, the wear resistance of hard Ag film was stronger than that of soft Ag film.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) connectorsilver platingfriction coefficientcontact resistancesliding friction
Paper # EMD2016-57
Date of Issue 2016-10-27 (EMD)

Conference Information
Committee EMD
Conference Date 2016/11/3(2days)
Place (in Japanese) (See Japanese page)
Place (in English) Awaji Yumebutai International Conference Center
Topics (in Japanese) (See Japanese page)
Topics (in English) International Session IS-EMD2016
Chair Yoshiteru Abe(NTT)
Vice Chair
Secretary (Sumitomo Denso)
Assistant Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.)

Paper Information
Registration To Technical Committee on Electromechanical Devices
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effect of hardness on wear and abrasion resistance of Silver plating on copper alloy
Sub Title (in English)
Keyword(1) connectorsilver platingfriction coefficientcontact resistancesliding friction
1st Author's Name Shigeru Sawada
1st Author's Affiliation AutoNetworks Technologies, Ltd.(AN-Tech)
2nd Author's Name Song-zhu Kure-chu
2nd Author's Affiliation Iwate University(Iwate Uni.)
3rd Author's Name Rie Nakagawa
3rd Author's Affiliation Iwate University(Iwate Uni.)
4th Author's Name Toru Ogasawara
4th Author's Affiliation Iwate University(Iwate Uni.)
5th Author's Name Hitoshi Yashiro
5th Author's Affiliation Iwate University(Iwate Uni.)
6th Author's Name Yasushi Saitoh
6th Author's Affiliation AutoNetworks Technologies, Ltd.(AN-Tech)
Date 2016-11-03
Paper # EMD2016-57
Volume (vol) vol.116
Number (no) EMD-283
Page pp.pp.41-46(EMD),
#Pages 6
Date of Issue 2016-10-27 (EMD)