Presentation 2016-08-25
Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate.
Motoyuki Nishizawa, Nobuaki Hatori, Yu Tanaka, Mitsuru Kurihara, Kazuhiko Kurata,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We are developing packaging technology of hybrid integrated light sources on Silicon platform for realization high capacity optical I/O with Si photonics technology for high-end server and next-generation supercomputers. 16-channel hybrid integrated light sources were developed by flip-chip-mounting laser diode (LD) arrays on Si platform fabricated at a foundry. 16-wavelength lasing was demonstrated as an example. On the other hand, we designed and fabricated the plastic packaging structure considering a cooling of LD arrays. We have realized sufficient optical couplings between LD and Si waveguides at all channels. Furthermore, we have found that the optical resin used for optical coupling had enough resistance to both solder reflow and flux washing when an optical I/O was mounted on a CPU package.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) silicon photonics / optical interconnect / laser diode / flip-chip maounting / integrated light source / plastic packaging / reflow treatment
Paper # R2016-20,EMD2016-24,CPM2016-33,OPE2016-54,LQE2016-29
Date of Issue 2016-08-18 (R, EMD, CPM, OPE, LQE)

Conference Information
Committee LQE / OPE / EMD / R / CPM
Conference Date 2016/8/25(2days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair Susumu Noda(Kyoto Univ.) / Kensuke Ogawa(Fujikura) / Yoshiteru Abe(NTT) / Hiroyasu Mawatari(NTT) / Satoru Noge(Numazu National College of Tech.)
Vice Chair Tsuyoshi Yamamoto(Fujitsu Labs.) / Kazutoshi Kato(Kyushu Univ.) / / Tetsushi Yuge(National Defense Academy) / Fumihiko Hirose(Yamagata Univ.)
Secretary Tsuyoshi Yamamoto(NTT) / Kazutoshi Kato(Tohoku Univ.) / (Keio Univ.) / Tetsushi Yuge(Mitsubishi Electric) / Fumihiko Hirose(Sumitomo Denso)
Assistant / Atsushi Aratake(NTT) / Katsumi Nakatsuhara(Kanagawa Inst. of Tech.) / Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.)

Paper Information
Registration To Technical Committee on Lasers and Quantum Electronics / Technical Committee on Optoelectronics / Technical Committee on Electromechanical Devices / Technical Committee on Reliability / Technical Committee on Component Parts and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate.
Sub Title (in English)
Keyword(1) silicon photonics
Keyword(2) optical interconnect
Keyword(3) laser diode
Keyword(4) flip-chip maounting
Keyword(5) integrated light source
Keyword(6) plastic packaging
Keyword(7) reflow treatment
1st Author's Name Motoyuki Nishizawa
1st Author's Affiliation Photonics Electronics Technology Research Association(PETRA)
2nd Author's Name Nobuaki Hatori
2nd Author's Affiliation Photonics Electronics Technology Research Association(PETRA)
3rd Author's Name Yu Tanaka
3rd Author's Affiliation Photonics Electronics Technology Research Association(PETRA)
4th Author's Name Mitsuru Kurihara
4th Author's Affiliation Photonics Electronics Technology Research Association(PETRA)
5th Author's Name Kazuhiko Kurata
5th Author's Affiliation Photonics Electronics Technology Research Association(PETRA)
Date 2016-08-25
Paper # R2016-20,EMD2016-24,CPM2016-33,OPE2016-54,LQE2016-29
Volume (vol) vol.116
Number (no) R-191,EMD-192,CPM-193,OPE-194,LQE-195
Page pp.pp.5-8(R), pp.5-8(EMD), pp.5-8(CPM), pp.5-8(OPE), pp.5-8(LQE),
#Pages 4
Date of Issue 2016-08-18 (R, EMD, CPM, OPE, LQE)