Presentation | 2016-08-25 Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate. Motoyuki Nishizawa, Nobuaki Hatori, Yu Tanaka, Mitsuru Kurihara, Kazuhiko Kurata, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We are developing packaging technology of hybrid integrated light sources on Silicon platform for realization high capacity optical I/O with Si photonics technology for high-end server and next-generation supercomputers. 16-channel hybrid integrated light sources were developed by flip-chip-mounting laser diode (LD) arrays on Si platform fabricated at a foundry. 16-wavelength lasing was demonstrated as an example. On the other hand, we designed and fabricated the plastic packaging structure considering a cooling of LD arrays. We have realized sufficient optical couplings between LD and Si waveguides at all channels. Furthermore, we have found that the optical resin used for optical coupling had enough resistance to both solder reflow and flux washing when an optical I/O was mounted on a CPU package. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | silicon photonics / optical interconnect / laser diode / flip-chip maounting / integrated light source / plastic packaging / reflow treatment |
Paper # | R2016-20,EMD2016-24,CPM2016-33,OPE2016-54,LQE2016-29 |
Date of Issue | 2016-08-18 (R, EMD, CPM, OPE, LQE) |
Conference Information | |
Committee | LQE / OPE / EMD / R / CPM |
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Conference Date | 2016/8/25(2days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | Susumu Noda(Kyoto Univ.) / Kensuke Ogawa(Fujikura) / Yoshiteru Abe(NTT) / Hiroyasu Mawatari(NTT) / Satoru Noge(Numazu National College of Tech.) |
Vice Chair | Tsuyoshi Yamamoto(Fujitsu Labs.) / Kazutoshi Kato(Kyushu Univ.) / / Tetsushi Yuge(National Defense Academy) / Fumihiko Hirose(Yamagata Univ.) |
Secretary | Tsuyoshi Yamamoto(NTT) / Kazutoshi Kato(Tohoku Univ.) / (Keio Univ.) / Tetsushi Yuge(Mitsubishi Electric) / Fumihiko Hirose(Sumitomo Denso) |
Assistant | / Atsushi Aratake(NTT) / Katsumi Nakatsuhara(Kanagawa Inst. of Tech.) / Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) |
Paper Information | |
Registration To | Technical Committee on Lasers and Quantum Electronics / Technical Committee on Optoelectronics / Technical Committee on Electromechanical Devices / Technical Committee on Reliability / Technical Committee on Component Parts and Materials |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate. |
Sub Title (in English) | |
Keyword(1) | silicon photonics |
Keyword(2) | optical interconnect |
Keyword(3) | laser diode |
Keyword(4) | flip-chip maounting |
Keyword(5) | integrated light source |
Keyword(6) | plastic packaging |
Keyword(7) | reflow treatment |
1st Author's Name | Motoyuki Nishizawa |
1st Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
2nd Author's Name | Nobuaki Hatori |
2nd Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
3rd Author's Name | Yu Tanaka |
3rd Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
4th Author's Name | Mitsuru Kurihara |
4th Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
5th Author's Name | Kazuhiko Kurata |
5th Author's Affiliation | Photonics Electronics Technology Research Association(PETRA) |
Date | 2016-08-25 |
Paper # | R2016-20,EMD2016-24,CPM2016-33,OPE2016-54,LQE2016-29 |
Volume (vol) | vol.116 |
Number (no) | R-191,EMD-192,CPM-193,OPE-194,LQE-195 |
Page | pp.pp.5-8(R), pp.5-8(EMD), pp.5-8(CPM), pp.5-8(OPE), pp.5-8(LQE), |
#Pages | 4 |
Date of Issue | 2016-08-18 (R, EMD, CPM, OPE, LQE) |