Presentation 2016-06-17
The Study of Electroless Nickel Plating -Surface Morphology and Hardening Behavior-
Rieko Mizuuchi, Yuji Hisazato, Kazuya Kodani,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Electroless nickel plating is widely used in industry. Electroless nickel plating has the following features, excellent corrosion resistance, easily applied to complex shapes and low cost compared to the other hard platings. We were verified the changes of the plating hardness, the surface morphology and the reliability due to differences in manufacturing conditions of electroless nickel plating.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electroless nickel plating / Hardness / Plated surface morphology
Paper # R2016-12
Date of Issue 2016-06-10 (R)

Conference Information
Committee R
Conference Date 2016/6/17(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Kikai-Shinko-Kaikan Bldg.
Topics (in Japanese) (See Japanese page)
Topics (in English) Reliability for electronics and electronic devices, Failure analysis, Overall reliability engineering
Chair Hiroyasu Mawatari(NTT)
Vice Chair Tetsushi Yuge(National Defense Academy)
Secretary Tetsushi Yuge(Fujitsu)
Assistant Maratt Zanikef(Kyushu Inst. of Tech.) / Nobuyuki Tamura(Hosei Univ.)

Paper Information
Registration To Technical Committee on Reliability
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) The Study of Electroless Nickel Plating -Surface Morphology and Hardening Behavior-
Sub Title (in English)
Keyword(1) Electroless nickel plating
Keyword(2) Hardness
Keyword(3) Plated surface morphology
1st Author's Name Rieko Mizuuchi
1st Author's Affiliation Toshiba Corporation(Toshiba)
2nd Author's Name Yuji Hisazato
2nd Author's Affiliation Toshiba Corporation(Toshiba)
3rd Author's Name Kazuya Kodani
3rd Author's Affiliation Toshiba Corporation(Toshiba)
Date 2016-06-17
Paper # R2016-12
Volume (vol) vol.116
Number (no) R-98
Page pp.pp.19-24(R),
#Pages 6
Date of Issue 2016-06-10 (R)