| Presentation | 2016-06-17 Thermal Analysis in 3D ICs Kaoru Furumi, Masashi Imai, Nanako Niioka, Atsushi Kurokawa, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Three-dimensional integrated circuits (3D ICs) lead to higher power densities than 2D ICs because of the stacking of multiple device layers. Thermal issue is one of the critical challenges in the field of 3D ICs. Since temperature affects signal delay and chip reliability, it is very important to clarify the impacts of various parameters on the maximum temperature in a 3D IC. In this report, we present several useful results obtained by thermal analysis with varying physical and material parameters of through-silicon-via (TSV) based 3D ICs. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Thermal Analysis / 3D IC / Through Silicon Vias (TSVs) / Heat Sink |
| Paper # | CAS2016-32,VLD2016-38,SIP2016-66,MSS2016-32 |
| Date of Issue | 2016-06-09 (CAS, VLD, SIP, MSS) |
| Conference Information | |
| Committee | VLD / CAS / MSS / SIP |
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| Conference Date | 2016/6/16(2days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hirosaki Shiritsu Kanko-kan |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | System, signal processing and related topics |
| Chair | Takashi Takenana(NEC) / Toshihiko Takahashi(Niigata Univ.) / Satoshi Yamane(Kanazawa Univ.) / Makoto Nakashizuka(Chiba Inst. of Tech.) |
| Vice Chair | Hiroyuki Ochi(Ritsumeikan Univ.) / Mitsuru Hiraki(Renesas) / Morikazu Nakamura(Univ. of Ryukyus) / Masahiro Okuda(Univ. of Kitakyushu) / Shogo Muramatsu(Niigata Univ.) |
| Secretary | Hiroyuki Ochi(Fujitsu Labs.) / Mitsuru Hiraki(Hiroshima City Univ.) / Morikazu Nakamura(Tohoku Univ.) / Masahiro Okuda(Renesas) / Shogo Muramatsu(Yamaguchi Univ.) |
| Assistant | Parizy Matthieu(Fujitsu Labs.) / Toshihiro Tachibana(Shonan Inst. of Tech.) / Yohei Nakamura(Hitachi) / Hideki Kinjo(Okinawa Univ.) / Osamu Watanabe(Takushoku Univ.) |
| Paper Information | |
| Registration To | Technical Committee on VLSI Design Technologies / Technical Committee on Circuits and Systems / Technical Committee on Mathematical Systems Science and its applications / Technical Committee on Signal Processing |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal Analysis in 3D ICs |
| Sub Title (in English) | |
| Keyword(1) | Thermal Analysis |
| Keyword(2) | 3D IC |
| Keyword(3) | Through Silicon Vias (TSVs) |
| Keyword(4) | Heat Sink |
| 1st Author's Name | Kaoru Furumi |
| 1st Author's Affiliation | Hirosaki University(Hirosaki Univ.) |
| 2nd Author's Name | Masashi Imai |
| 2nd Author's Affiliation | Hirosaki University(Hirosaki Univ.) |
| 3rd Author's Name | Nanako Niioka |
| 3rd Author's Affiliation | Hirosaki University(Hirosaki Univ.) |
| 4th Author's Name | Atsushi Kurokawa |
| 4th Author's Affiliation | Hirosaki University(Hirosaki Univ.) |
| Date | 2016-06-17 |
| Paper # | CAS2016-32,VLD2016-38,SIP2016-66,MSS2016-32 |
| Volume (vol) | vol.116 |
| Number (no) | CAS-93,VLD-94,SIP-95,MSS-96 |
| Page | pp.pp.173-178(CAS), pp.173-178(VLD), pp.173-178(SIP), pp.173-178(MSS), |
| #Pages | 6 |
| Date of Issue | 2016-06-09 (CAS, VLD, SIP, MSS) |