Presentation 2016-06-17
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa, Yoshitaka Sugiyama,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards. When a discharge current from a capacitor bank passes through a one-turn flat coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in an insulated aluminum driver sheet and the copper foils placed on the coil. The foils have a gap between them. Electromagnetic force acts on the driver sheet nearer the coil and accelerates the sheet and lets the foils collide. The foils are welded with the bank energy less than 1.2 kJ. Experimental results including the interfacial observation are reported.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Printed circuit board / Rigid board / Flexible board / Copper foil / Magnetic pulse welding / Interfacial observation
Paper # EMD2016-15,CPM2016-22,OME2016-25
Date of Issue 2016-06-10 (EMD, CPM, OME)

Conference Information
Committee EMD / CPM / OME
Conference Date 2016/6/17(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Kikai-Shinko-Kaikan Bldg.
Topics (in Japanese) (See Japanese page)
Topics (in English) Marterial・Device Summer Meeting
Chair Yoshiteru Abe(NTT) / Satoru Noge(Numazu National College of Tech.) / Naoki Matsuda(AIST)
Vice Chair / Fumihiko Hirose(Yamagata Univ.) / Tatsuo Mori(Aichi Inst. of Tech.)
Secretary (Sumitomo Denso) / Fumihiko Hirose(Fujielectric) / Tatsuo Mori(NTT)
Assistant Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Hirotake Kajii(Osaka Univ.) / Dai Taguchi(Tokyo Inst. of Tech.)

Paper Information
Registration To Technical Committee on Electromechanical Devices / Technical Committee on Component Parts and Materials / Technical Committee on Organic Molecular Electronics
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report)
Sub Title (in English)
Keyword(1) Printed circuit board
Keyword(2) Rigid board
Keyword(3) Flexible board
Keyword(4) Copper foil
Keyword(5) Magnetic pulse welding
Keyword(6) Interfacial observation
1st Author's Name Tomokatsu Aizawa
1st Author's Affiliation Tokyo Metropolitan College of Technology(Tokyo Metropolitan College)
2nd Author's Name Yoshitaka Sugiyama
2nd Author's Affiliation Yazaki Corporation(Yazaki)
Date 2016-06-17
Paper # EMD2016-15,CPM2016-22,OME2016-25
Volume (vol) vol.116
Number (no) EMD-99,CPM-100,OME-101
Page pp.pp.39-42(EMD), pp.39-42(CPM), pp.39-42(OME),
#Pages 4
Date of Issue 2016-06-10 (EMD, CPM, OME)