| Presentation | 2016-06-17 Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report) Tomokatsu Aizawa, Yoshitaka Sugiyama, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards. When a discharge current from a capacitor bank passes through a one-turn flat coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in an insulated aluminum driver sheet and the copper foils placed on the coil. The foils have a gap between them. Electromagnetic force acts on the driver sheet nearer the coil and accelerates the sheet and lets the foils collide. The foils are welded with the bank energy less than 1.2 kJ. Experimental results including the interfacial observation are reported. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Printed circuit board / Rigid board / Flexible board / Copper foil / Magnetic pulse welding / Interfacial observation |
| Paper # | EMD2016-15,CPM2016-22,OME2016-25 |
| Date of Issue | 2016-06-10 (EMD, CPM, OME) |
| Conference Information | |
| Committee | EMD / CPM / OME |
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| Conference Date | 2016/6/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Marterial・Device Summer Meeting |
| Chair | Yoshiteru Abe(NTT) / Satoru Noge(Numazu National College of Tech.) / Naoki Matsuda(AIST) |
| Vice Chair | / Fumihiko Hirose(Yamagata Univ.) / Tatsuo Mori(Aichi Inst. of Tech.) |
| Secretary | (Sumitomo Denso) / Fumihiko Hirose(Fujielectric) / Tatsuo Mori(NTT) |
| Assistant | Yoshiki Kayano(Univ. of Electro-Comm.) / Yuichi Hayashi(Tohoku Gakuin Univ.) / Takashi Sakamoto(NTT) / Yuichi Nakamura(Toyohashi Univ. of Tech.) / Hirotake Kajii(Osaka Univ.) / Dai Taguchi(Tokyo Inst. of Tech.) |
| Paper Information | |
| Registration To | Technical Committee on Electromechanical Devices / Technical Committee on Component Parts and Materials / Technical Committee on Organic Molecular Electronics |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report) |
| Sub Title (in English) | |
| Keyword(1) | Printed circuit board |
| Keyword(2) | Rigid board |
| Keyword(3) | Flexible board |
| Keyword(4) | Copper foil |
| Keyword(5) | Magnetic pulse welding |
| Keyword(6) | Interfacial observation |
| 1st Author's Name | Tomokatsu Aizawa |
| 1st Author's Affiliation | Tokyo Metropolitan College of Technology(Tokyo Metropolitan College) |
| 2nd Author's Name | Yoshitaka Sugiyama |
| 2nd Author's Affiliation | Yazaki Corporation(Yazaki) |
| Date | 2016-06-17 |
| Paper # | EMD2016-15,CPM2016-22,OME2016-25 |
| Volume (vol) | vol.116 |
| Number (no) | EMD-99,CPM-100,OME-101 |
| Page | pp.pp.39-42(EMD), pp.39-42(CPM), pp.39-42(OME), |
| #Pages | 4 |
| Date of Issue | 2016-06-10 (EMD, CPM, OME) |