| Presentation | 2016-03-11 Study of crosstalk between ground slot and lines in PCB with 3 layers. Teruo Tobana, Takayuki Sasamori, Yoji Isota, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Recently, by advance of miniaturization of electronic devices, a ground of a printed circuit board is tend to be small and complicated and the ground may have some defects, such as connectors or clearance halls of vias. In this paper, we calculated electromagnetic coupling between microstrip lines on different layers in 3 layers printed circuit board with a narrow slot which is on the ground using multi-conductor transmission line method. In order to calculate some electromagnetic coupling, per-unit-length parameters between the slot and the microstrip line are calculated using the spectral domain method. In this paper, we showed that electromagnetic coupling between lines on different layers through a ground slot is calculated using MTL method. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | coupling / multiconductor-transmission-line / ground slot / three layers PCB |
| Paper # | EMCJ2015-132 |
| Date of Issue | 2016-03-04 (EMCJ) |
| Conference Information | |
| Committee | EMCJ |
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| Conference Date | 2016/3/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | EMC |
| Chair | Hideaki Sone(Tohoku Univ.) |
| Vice Chair | Osami Wada(Kyoto Univ.) |
| Secretary | Osami Wada(Okayama Univ.) |
| Assistant | Atsuhiro Takahashi(Toyota Central R&D Labs.) / Yoshiki Kayano(Akita Univ.) / Yusaku Katsube(Hitachi) |
| Paper Information | |
| Registration To | Technical Committee on Electromagnetic Compatibility |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study of crosstalk between ground slot and lines in PCB with 3 layers. |
| Sub Title (in English) | |
| Keyword(1) | coupling |
| Keyword(2) | multiconductor-transmission-line |
| Keyword(3) | ground slot |
| Keyword(4) | three layers PCB |
| 1st Author's Name | Teruo Tobana |
| 1st Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| 2nd Author's Name | Takayuki Sasamori |
| 2nd Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| 3rd Author's Name | Yoji Isota |
| 3rd Author's Affiliation | Akita Prefectural University(Akita Pref. Univ.) |
| Date | 2016-03-11 |
| Paper # | EMCJ2015-132 |
| Volume (vol) | vol.115 |
| Number (no) | EMCJ-509 |
| Page | pp.pp.45-50(EMCJ), |
| #Pages | 6 |
| Date of Issue | 2016-03-04 (EMCJ) |