Presentation 2016-01-22
[Invited Talk] TSV Process Technology by Printing
Hiroaki Ikeda, Shigenobu Sekine, Ryuji Kimura, koichi Shimokawa, keiji Okada, Hiroaki Shindo, Tatsuya Ooi, Rei Tamaki, Makoto Nagata,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English)
Keyword(in Japanese) (See Japanese page)
Keyword(in English)
Paper # SDM2015-119
Date of Issue 2016-01-15 (SDM)

Conference Information
Committee SDM
Conference Date 2016/1/22(1days)
Place (in Japanese) (See Japanese page)
Place (in English) Sanjo Conference Hall, The University of Tokyo
Topics (in Japanese) (See Japanese page)
Topics (in English) Interconnects, Package and related materials
Chair Yuzou Oono(Univ. of Tsukuba)
Vice Chair Tatsuya Kunikiyo(Renesas)
Secretary Tatsuya Kunikiyo(Tohoku Univ.)
Assistant Tadashi Yamaguchi(Renesas)

Paper Information
Registration To Technical Committee on Silicon Device and Materials
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) [Invited Talk] TSV Process Technology by Printing
Sub Title (in English) Application of Nano-Function Materials
Keyword(1)
1st Author's Name Hiroaki Ikeda
1st Author's Affiliation Napra Co., Ltd.(Napra)
2nd Author's Name Shigenobu Sekine
2nd Author's Affiliation Napra Co., Ltd.(Napra)
3rd Author's Name Ryuji Kimura
3rd Author's Affiliation Napra Co., Ltd.(Napra)
4th Author's Name koichi Shimokawa
4th Author's Affiliation Napra Co., Ltd.(Napra)
5th Author's Name keiji Okada
5th Author's Affiliation Napra Co., Ltd.(Napra)
6th Author's Name Hiroaki Shindo
6th Author's Affiliation Napra Co., Ltd.(Napra)
7th Author's Name Tatsuya Ooi
7th Author's Affiliation Napra Co., Ltd.(Napra)
8th Author's Name Rei Tamaki
8th Author's Affiliation Napra Co., Ltd.(Napra)
9th Author's Name Makoto Nagata
9th Author's Affiliation Kobe-University(Kobe-Univ.)
Date 2016-01-22
Paper # SDM2015-119
Volume (vol) vol.115
Number (no) SDM-417
Page pp.pp.49-54(SDM),
#Pages 6
Date of Issue 2016-01-15 (SDM)